Pre-order Enquiry
Download Free Sample
Healthcare
Aerospace & Defence
Agriculture
Automations
Chemicals & Advanced Materials
Food & Beverages
Information & Communication Technology
Oil & Gas
Power & Energy
The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.15 billion in the third first quarter of 2019, up 12.1% sequentially and 1.7% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectory. The industry is expected to have continued growth momentum in the fourth quarter, reaching US$4.2 billion.
Frequently Asked Questions
This market study covers the global and regional market with an
in-depth analysis of the
overall growth prospects...
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by
highlighting information on
different aspects including drivers, restraints...
