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The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.37 billion in the second first quarter of 2019, up 8.5% sequentially. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectory. Although the industry is anticipated to have seen a pickup in shipment value in the second half of 2019, the industry’s shipment value is projected to witness a slight year-on-year decline in 2019 compared to 2018.
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.