The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 3.37 billion in the second first quarter of 2019, up 8.5% sequentially. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications are expected to be major growth drivers to bolster high-end wafer-level packaging service demand thus the industry is anticipated to continue on the growth trajectory. Although the industry is anticipated to have seen a pickup in shipment value in the second half of 2019, the industry’s shipment value is projected to witness a slight year-on-year decline in 2019 compared to 2018.
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