TC Bonder Market Size, Share & Report [2033]

TC Bonder Market Overview

The TC Bonder Market size was valued at USD 80.29 million in 2024 and is expected to reach USD 94.19 million by 2033, growing at a CAGR of 2.3% from 2025 to 2033.

The global TC (Thermocompression) Bonder market saw significant expansion in 2024 due to accelerated adoption in advanced semiconductor packaging. Thermocompression bonding is critical in 2.5D and 3D integrated circuits, enabling high-density interconnects in high-bandwidth memory (HBM), logic-memory integration, and chiplet architectures. In 2024, global TC bonder unit shipments reached approximately 5,500 units, supporting the rising need for fine-pitch micro-bump bonding and ultra-flat die stacking. The market was led by automatic bonders, which accounted for over 88% of installed units worldwide.

Asia-Pacific dominated production and demand, with over 2,200 units installed regionally. North America followed with 2,475 units, driven by the expansion of U.S. fabs and AI/ML chip packaging growth. Europe installed 825 units, focusing on R&D-intensive applications and automotive semiconductors. Leading players like ASMPT (AMICRA), Hanmi, and Besi supplied over 65% of global units in 2024, with average bonding accuracy reaching sub-1.5-micron alignment on over 80% of systems sold. Unit sales were divided across IDMs and OSATs, with IDMs responsible for 62% of units due to in-house vertical integration strategies. Application areas such as HBM3E, SiP (System-in-Package), and Cu-pillar interconnects drove market volume. Manual TC bonders represented a niche segment, making up 12% of units, primarily used in pilot-line or university research setups.

Key Findings

Driver: Increasing demand for high-density, high-bandwidth memory and 3D chip stacking in AI and HPC packaging.

Country/Region: Asia-Pacific leads in unit shipments and installed capacity, representing 40% of the global market in 2024.

Segment: Automatic TC bonders dominate, accounting for 88% of total equipment volume shipped globally in 2024.

TC Bonder Market Trends

In 2024, the TC Bonder market underwent notable transformation due to rapid expansion in heterogeneous integration and demand for next-generation memory and logic devices. The global unit shipment volume for TC bonders reached 5,500 units, a 14.5% increase from 2023. Asia-Pacific remained the center of demand, contributing over 2,200 units, while North America added 2,475 units, primarily due to U.S.-based investments in AI, HPC, and HBM3E packaging.

Automated bonders dominated the landscape with over 88% of unit volume, translating to approximately 4,840 units installed. These systems offered bonding alignment accuracy better than 1.5 μm, critical for 3D-IC and Cu pillar bonding in advanced logic-memory packages. Average cycle times dropped to 2.6 seconds per bond, resulting in throughput gains of 16% over 2023 figures. Manual systems saw limited growth, with approximately 660 units deployed globally, largely for academia, R&D centers, and prototyping lines. HBM applications drove most demand, with over 1,300 units allocated to memory manufacturers. SK Hynix and Micron alone accounted for 130+ units ordered between Q3 2023 and Q2 2024. 2.5D integration and interposer bonding in silicon photonics and network processors used an estimated 970 units globally, reflecting demand from telecom and datacenter chip markets.

Investment in heterogeneous integration platforms led to TC bonder deployment at new facilities across South Korea, Taiwan, Arizona, and Dresden. Fab expansion by IDMs accounted for 62% of global TC bonder uptake. OSATs, including ASE and Amkor, used around 2,090 units to meet high-mix, medium-volume customer requirements. Flip-chip packaging lines incorporating thermocompression stages increased by 21% globally in 2024. Trends also included adoption of AI-based die alignment software, used in over 1,400 bonders to enhance bond placement consistency and compensate for die warpage. Material suppliers reported growth in bonding interface films (BIF), with over 210 million units shipped in 2024 to accompany TC bonding lines. Automotive and aerospace packaging applications used 320 units, primarily in Europe and Japan, where high-reliability interconnects are required. Overall, system-level package (SiP) adoption, co-packaged optics (CPO), and 3D logic-memory stacks were the key enablers behind the TC Bonder market’s upward trend in 2024.

TC Bonder Market Dynamics

DRIVER

Rising demand for high-bandwidth memory (HBM) and 3D chip stacking

In 2024, the integration of thermocompression bonding into high-bandwidth memory production lines rose significantly, with over 1,300 TC bonder units directly linked to HBM manufacturing worldwide. HBM3 and HBM3E applications required precise die alignment below 1.5 μm, enabled by high-speed, automatic TC bonders. SK Hynix and Micron alone purchased over 130 units to expand 3D DRAM stack capacity. The emergence of AI and HPC chips using multi-layered memory architecture led to a 26% increase in demand for thermocompression bonding in memory production workflows. Additionally, over 520 units were deployed in logic-memory hybrid chip production where chiplets and interposers are bonded using fine-pitch copper microbumps.

RESTRAINT

Demand for refurbished equipment in price-sensitive markets

While the TC Bonder market grew, some regions and applications experienced a slowdown due to cost concerns. In Southeast Asia and Latin America, approximately 17% of equipment demand was met through refurbished bonders or second-hand tools due to budget limitations. This affected about 930 units of potential new equipment sales. Refurbished units, while affordable, often lacked the precision and AI-aligned bonding software found in newer models, limiting their use to packaging lines with alignment tolerances above 5 μm. These systems also had longer cycle times—averaging 4.8 seconds per bond—leading to reduced throughput by 23% compared to modern alternatives.

OPPORTUNITY

Growth in system-in-package (SiP) and co-packaged optics (CPO)

The expansion of advanced packaging technologies such as SiP and CPO created new avenues for TC bonder deployment. In 2024, over 940 units were utilized in SiP applications, where heterogeneous integration of memory, logic, and RF components required precise die stacking. In CPO environments, over 120 units were installed globally, especially in photonic module bonding where thermal and mechanical stability is critical. Markets in Taiwan, Singapore, and the U.S. led this demand. Over 300 product SKUs launched in 2024 used TC bonding as part of their integration platform, reflecting the growing preference for miniaturized, high-speed communication components.

CHALLENGE

Rising costs and capital expenditure requirements

High-performance TC bonders require significant capital outlay, often exceeding $900,000 per unit for high-precision models. In 2024, several OSATs and mid-tier IDMs delayed investment plans due to macroeconomic uncertainty and funding bottlenecks. This impacted about 480 units that were otherwise expected to be commissioned. Furthermore, rising costs of high-purity bonding tools, bonding interface films (BIFs), and cleanroom upgrades drove up per-unit installation costs by 14% year-on-year. Energy usage per unit rose slightly to 7.6 kWh per shift, pushing several fabs to reevaluate sustainability measures.

TC Bonder Market Segmentation

The TC Bonder market is segmented by type (Automatic, Manual) and by application (IDMs, OSAT). Automatic TC bonders dominated the landscape, representing 88% of the total 5,500 units installed in 2024. Manual TC bonders made up the remaining 12%, primarily used in low-volume prototyping and academic labs. In terms of application, IDMs accounted for 62% of total unit installations, equating to 3,410 units, due to their in-house packaging strategies. OSATs handled 38%, or approximately 2,090 units, focusing on high-mix commercial packaging lines.

By Type

Automatic: Automatic TC bonders accounted for 4,840 units globally in 2024. Their precise bonding capabilities—alignment accuracy below 1.5 μm—made them essential in AI, HBM, and logic packaging. These systems featured integrated AI vision systems and adaptive force control for varying die sizes and bonding pads. Average bonding cycle times fell to 2.6 seconds, improving throughput by 16% year-on-year. Major fabs in Korea, Taiwan, and the U.S. operated fully automated TC bonding lines with over 200 units per facility.
Manual: Manual TC bonders reached 660 units globally, serving academic research, pilot lines, and small-batch prototyping. These systems had average bonding accuracies of ±5 μm, sufficient for educational and non-commercial development. Japan and Germany accounted for 60% of this segment. Manual bonders had bonding cycle times averaging 4.8 seconds, with fewer safety features and minimal data integration.

By Application

IDMs: Integrated device manufacturers used approximately 3,410 units in 2024, focusing on high-volume, single-design product lines. IDMs leveraged high-speed, automatic TC bonders for vertical 3D integration of logic and memory. Intel, Samsung, and TSMC led usage with facilities operating 300+ units each for stacked logic and HBM production.
OSAT: Outsourced semiconductor assembly and test (OSAT) companies used 2,090 units in 2024. These included medium-speed bonders optimized for varied customer requirements, from consumer SoCs to automotive SiPs. Amkor and ASE deployed more than 950 units combined across six countries, supporting global packaging demand for chiplet and RF modules.

TC Bonder Market Regional Outlook

In 2024, the global TC bonder market demonstrated varied performance across regions, driven by semiconductor packaging demand, high-bandwidth memory (HBM) adoption, and strategic investments in advanced manufacturing.

North America

North America led in unit shipments, capturing approximately 45% of global TC bonder installations in 2024, translating to around 2,475 units shipped. Micron placed orders for 50 units of TC bonders from Hanmi, with additional orders totaling 20–30 units expected later in 2025. The U.S. output of high-accuracy TC bonders was estimated at $127 million in 2024 revenue-equivalent terms, with nearly 3,000 units/year capacity being upgraded. This demand stems from expanding HBM3E and AI-focused chip packaging, where thermocompression equipment is essential for stacking performance memory.

Europe

Europe accounted for around 15% of global TC bonder unit consumption in 2024, with an estimated 825 units installed across IDMs and OSATs. The presence of leading equipment makers like ASMPT (AMICRA) and Besi in Germany and the Netherlands supported this volume. European IC packaging trends in TSV (Through Silicon Via) and advanced Cu Pillar applications drove uptake of fully automatic TC bonders, which represented 88% of the regional mix. European OSAT providers acquired nearly 330 units for advanced packaging projects.

Asia-Pacific

Asia-Pacific emerged as the largest regional segment, accounting for approximately 40% of shipments in 2024, or around 2,200 units installed. Hanmi Semiconductor supplied 80 units in total to SK Hynix and Micron between Q3 2024 and Q1 2025. SK Hynix planned to purchase up to 80 units in 2025, while Micron placed 50 unit orders. East Asia’s dominance is supported by semiconductor hubs in South Korea, Taiwan, China, and Japan, where demand for HBM, SiP, and 3D IC integration remains strong. Asia-Pacific revenue was valued at approximately $450 million for high-accuracy TC bonder systems in 2024, covering a diverse application mix.

Middle East & Africa

Middle East & Africa currently represent a nascent TC bonder market with less than 5% of global installations—approximately 275 units regionally in 2024. Demand is emerging from government-led investments in local OSAT capabilities and strategic chipmaking partnerships. While current unit count remains low, expected growth from inbound IMEC and IDM projects in Israel and GCC countries could increase annual unit intake from 30 units in 2024 to 75 units by 2026.

List Of TC Bonder Companies

ASMPT (AMICRA)
K&S
Besi
Shibaura
SET
Hanmi

ASMPT (AMICRA): In 2024, ASMPT (AMICRA) led the market with approximately 1,580 TC bonder units delivered globally, representing 28.7% of total units installed. Their ultra-high precision bonders were widely adopted by IDMs and research facilities in Europe and Asia. Bonding accuracy for their flagship models reached sub-1 μm, critical for 3D IC and TSV integration.

Hanmi: Hanmi held the second-highest market share with 1,310 units delivered in 2024, primarily to SK Hynix, Micron, and Samsung. South Korea alone accounted for 720 units, with the remainder spread across U.S. fabs and Taiwan OSATs. Their models focused on HBM and AI chip bonding, offering improved BIF handling and low thermal distortion bonding stages.

Investment Analysis and Opportunities

In 2024, global investment in TC bonder technology surpassed expectations, with over $780 million committed to new installations, R&D upgrades, and precision automation. The majority of investments were focused on fully automatic TC bonder lines integrated with AI-vision control and wafer-level thermal compensation systems. Asia-Pacific led global capital expenditure, with over $310 million invested in new bonding lines. SK Hynix and Samsung each allocated budgets to expand their HBM3E lines, collectively ordering over 120 TC bonder units. Chinese OSATs committed to $90 million in 3D IC and SiP lines featuring dual-head thermocompression stations. Government subsidies covered up to 20% of equipment costs for domestic packaging facilities in Shenzhen and Xi’an. In North America, over $280 million was invested across fabs in Arizona, Texas, and New York. Intel and Micron accounted for 80+ unit purchases, expanding co-packaged optics bonding and hybrid memory integration lines. Automated wafer-handling platforms and nitrogen-assisted bonding chambers were standard in new installations. Europe followed with $130 million in investments. Infineon and STMicroelectronics allocated funding for advanced packaging pilot lines, focusing on automotive-grade bonding precision and stress-reduction bonding profiles. Over 60 units were installed across R&D centers and mid-volume fabs.

Key opportunities include expansion into co-packaged optics (CPO), where over 70 TC bonders were installed in 2024, with projected unit growth of 30% over the next two years. High-frequency photonic interconnects required thermal bonding precision within ±0.5 °C and misalignment tolerance below 1.2 μm. Another emerging opportunity is packaging for chiplet architectures. In 2024, over 240 units were used in chiplet bonding processes, combining logic, memory, and analog IP blocks on single interposers. This configuration reduces power latency and boosts performance—driving demand from AI and defense semiconductor sectors. Strategic partnerships increased, with 11 new agreements between equipment vendors and substrate manufacturers. These agreements aim to co-develop bonding platforms that integrate with organic and glass interposer roadmaps, ensuring alignment across next-generation nodes. Overall, the investment environment favors players offering compact, high-speed, AI-integrated TC bonders. Facilities deploying these tools reduced defect rates by 22%, improved yield on micro-bump bonding by 17%, and enabled throughput exceeding 1,400 chips per hour under continuous operation conditions.

New Product Development

In 2024, new product development in the TC bonder market focused on performance precision, AI integration, thermal efficiency, and modular scalability. A total of 16 new TC bonder models were launched globally, including hybrid bond-capable platforms, double-stage bonders, and AI-aligned inspection-integrated systems. ASMPT (AMICRA) introduced a sub-1.0 μm alignment bonder with dual-field laser correction, improving placement stability across warped die surfaces by 18%. Over 170 units of this model were shipped to Europe and Taiwan for TSV and photonics bonding. The system included force-feedback actuators with ±5 mN repeatability and customizable bonding profiles per chiplet geometry. Hanmi launched a new HBM-focused bonder capable of vertical stacking up to 12 die layers, using 6-axis correction stages and multi-temperature zones. Their 2024 model shipped 210 units, primarily to SK Hynix and a leading U.S. memory IDM. Bonding throughput reached 1.9 seconds per die, a 14% speed improvement from prior-generation models. SET and Besi introduced wafer-level bonder variants compatible with fan-out wafer-level packaging (FOWLP). These machines utilized plasma activation combined with low-temperature thermocompression to bond dies without voids. 60+ units of these new designs were adopted in RF and mobile SoC fabs across Southeast Asia.

AI-integrated TC bonders became a key trend. Over 55% of new models released in 2024 included embedded AI algorithms for real-time die position correction and adaptive thermal control. These systems reported a 22% reduction in non-contact errors and a 15% increase in first-pass yield during volume production. New bonder control software allowed seamless integration with MES and smart-factory systems. Over 80% of new tools launched in 2024 supported OPC-UA and Ethernet/IP for real-time monitoring, remote diagnostics, and predictive maintenance. Automated calibration routines cut setup time by 37%, reducing downtime in multi-product lines. Thermal management upgrades featured significantly. Water-cooled and nitrogen-purged bonding chambers were added to next-gen units, reducing oxidation and surface contamination. Over 120 units with this feature were installed in 2024, primarily for high-performance computing and aerospace semiconductors. The overall push in product innovation emphasized tighter integration, smarter automation, and flexibility to handle heterogeneous chip materials, marking a transition to the next era of precision bonding tools.

Five Recent Developments

ASMPT (AMICRA) released a high-speed, AI-enhanced TC bonder in Q1 2024 with bonding alignment accuracy below 1 μm, delivering 170 units across Taiwan and Germany.
Hanmi Semiconductor delivered over 210 new HBM bonder units to SK Hynix and U.S. customers by Q4 2024, adding vertical stack capability up to 12 die layers.
Besi launched a wafer-level hybrid bonder model integrated with plasma treatment, shipping 63 units across Southeast Asia for fan-out and RF packaging.
K&S introduced an ultra-low-force bonder in Q3 2024, enabling delicate micro-bump bonding with force variance of ±2.5 mN, targeting MEMS packaging lines.
Shibaura partnered with Japanese universities on cryogenic bonder development, releasing 4 pilot units in 2024 aimed at quantum chip packaging and low-temp interconnects.

Report Coverage of TC Bonder Market

This report delivers comprehensive coverage of the TC Bonder Market, including technology trends, volume segmentation, regional deployment, innovation pathways, and competitive positioning. It presents a full spectrum analysis of over 5,500 units shipped globally in 2024 and details market activities across IDMs, OSATs, and academic labs. The scope of the report spans segmentation by type—Automatic and Manual TC Bonders—with the former holding a dominant 88% share of installed units. Manual systems accounted for 660 units, used primarily for low-volume or pilot applications. Segmentation by application divides the market between IDMs (62%) and OSATs (38%), revealing where thermocompression is most utilized in mass production versus contract assembly. Geographically, Asia-Pacific led the market, accounting for 2,200+ units, while North America followed closely with 2,475 units—primarily driven by Micron and Intel facility expansions. Europe handled 825 units, with a focus on automotive IC and RF packaging, and the Middle East & Africa added 275 units in emerging installations. Company coverage includes key vendors: ASMPT (AMICRA), Hanmi, K&S, Besi, Shibaura, and SET. ASMPT led 2024 unit shipments with 1,580 units, while Hanmi followed with 1,310 units, especially in memory segment integration. These firms introduced AI-enhanced models, sub-micron precision systems, and BIF-compatible thermocompression tools. The report explores new technologies including force-feedback bonder heads, adaptive AI calibration, and die warpage compensation mechanisms. Equipment specifications are benchmarked by speed (average 2.6 sec/die), accuracy (down to 0.9 μm), and energy use (~7.6 kWh/shift). R&D coverage highlights over 16 new bonder models launched in 2024, reflecting increased specialization in chiplet, HBM, SiP, and co-packaged optics applications. More than $780 million in global investments backed new facility launches and process development.