Copper Clad Laminate (CCL) and Prepreg Market Report

Copper Clad Laminate (CCL) and Prepreg Market Overview

The Copper Clad Laminate (CCL) and Prepreg Market size was valued at USD 15160.44 million in 2024 and is expected to reach USD 23027.01 million by 2033, growing at a CAGR of 4.2% from 2025 to 2033.

The Copper Clad Laminate (CCL) and Prepreg market serves as the foundational backbone of the printed circuit board (PCB) industry, providing essential dielectric and conductive materials for electronic components. In 2023, the global consumption of CCL exceeded 930 million square meters, while the demand for prepreg reached over 780 million square meters. CCL, composed of a dielectric base reinforced with glass fiber or paper and clad on one or both sides with copper foil, is critical in facilitating signal integrity and power management in electronic circuits. Prepreg materials, typically epoxy-impregnated fiberglass sheets, are used in multilayer PCBs to bond different CCL layers, with thicknesses ranging from 0.05 mm to 0.2 mm and resin content levels between 35% and 65%. These materials provide structural integrity and electrical insulation, particularly in high-layer count PCBs where reliability under thermal cycling is critical. CCLs are categorized by resin type, with FR-4 epoxy being the dominant segment, accounting for over 70% of global volume. High-speed digital and RF/microwave applications are pushing demand for advanced resin systems such as polyimide, BT epoxy, and hydrocarbon-based CCLs with dielectric constants below 3.4 and dissipation factors under 0.003 at 10 GHz. Asia-Pacific is the largest producer and consumer of CCL and prepreg, with China contributing over 65% of global CCL output.

Taiwan and South Korea are major suppliers of high-performance prepreg used in 5G infrastructure and server applications. In contrast, North America and Europe specialize in high-end and military-grade CCLs with flame retardant (UL 94 V-0), high CTI (>600V), and lead-free compatibility. The increasing penetration of high-speed computing, 5G communications, and electric vehicles (EVs) is driving substantial growth in this market. In 2023, over 75 million square meters of CCL were consumed in server boards, and more than 65 million square meters were used in vehicle electronics. Innovations in resin systems and copper foil technology, including reverse treated and low-profile copper, are enabling better performance in HDI (High-Density Interconnect) and SAP (Semi-Additive Process) PCBs. Environmental compliance, recyclability, and halogen-free standards are also shaping product development, with over 55% of new product launches in 2023 targeting RoHS, REACH, and IPC-4101D certifications.

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Key Findings

Driver: Expanding deployment of 5G base stations, electric vehicles, and cloud infrastructure is increasing demand for high-frequency CCL and prepreg.

Country/Region: China leads the market with over 65% of total CCL production and more than 500 million square meters consumed domestically in 2023.

Segment: FR-4 CCL is the most widely used product category, representing over 70% of global consumption across standard PCBs.

Copper Clad Laminate (CCL) and Prepreg Market Trends

The Copper Clad Laminate and Prepreg market is undergoing transformative shifts driven by advanced electronics applications and miniaturization requirements. One major trend is the demand for high-speed, low-loss laminates for 5G base stations and high-frequency network hardware. In 2023, over 95 million square meters of low-loss CCL (with Dk <3.4 and Df <0.0035) were produced to support 5G rollouts across China, South Korea, and the United States. With HDI PCB designs requiring finer features and tighter signal control, manufacturers are increasingly adopting low-profile copper foil (Rz <2 μm) and thin core laminates below 0.1 mm in thickness. Over 180 million square meters of CCL produced in 2023 featured ultra-thin cores or reverse-treated copper, up 17% year-over-year. Prepreg formulations are evolving to meet thermal reliability standards for applications in servers, industrial automation, and EV power systems. In 2023, over 120 million square meters of prepreg were used in PCBs for electric drivetrain controllers and battery management systems, requiring glass transition temperatures (Tg) above 170°C and decomposition temperatures (Td) over 320°C.

Sustainability is gaining momentum, with over 40% of CCL manufacturers shifting to halogen-free, lead-free, and recyclable substrates. In Europe, over 65 million square meters of CCL shipped in 2023 complied with IEC 61249-2-21 standards for halogen-free materials, particularly in consumer electronics and automotive applications. The integration of flexible and rigid-flex PCBs in wearables and IoT devices is boosting demand for flex-compatible CCL and prepreg. In 2023, more than 35 million square meters of polyimide-based laminates were produced globally, a 12% increase from 2022, as manufacturers target ultra-light, high-frequency circuitry. Technology collaborations between CCL manufacturers and copper foil producers have led to the commercialization of reverse-treated copper with improved adhesion and peel strength. Over 160 million square meters of reverse-treated copper CCLs were used in 2023, primarily in smartphones, tablets, and automotive camera modules. Finally, automation in lamination processes is improving quality and reducing costs. Over 55% of CCL production lines in Asia now feature automated hot-press lamination systems, improving throughput by 22% and reducing defect rates to below 0.8% per batch.

Copper Clad Laminate (CCL) and Prepreg Market Dynamics

DRIVER

Rising demand from 5G and high-performance computing sectors

The primary driver of the CCL and prepreg market is the global adoption of high-speed communication and computing technologies. In 2023, over 500,000 5G base stations were deployed globally, each requiring multilayer PCBs with low-loss prepreg and high-frequency CCLs. Data center expansions led to the consumption of more than 75 million square meters of high-Tg CCLs in server boards and AI accelerators. Applications such as radar modules, millimeter wave antennas, and high-speed connectors increasingly rely on prepreg with low Df (<0.004) and stable dielectric performance up to 40 GHz.

RESTRAINT

Price volatility in raw materials and supply chain constraints

Raw material dependency, especially on copper foil and glass fabric, presents a major market restraint. In 2023, copper prices fluctuated by over 21%, while high-quality E-glass fabric faced supply tightening due to high demand from wind turbine and EV battery applications. These inputs account for 35–45% of the total cost of CCL production. Laminators reported cost increases of 12–18%, leading to narrower margins and pass-through pressures on PCB manufacturers. Additionally, supply disruptions in epoxy and BT resins affected over 22% of scheduled production in Taiwan and South Korea in 2023.

OPPORTUNITY

Integration in electric vehicles and ADAS modules

Electric vehicle adoption presents a significant growth opportunity. In 2023, over 10 million EVs were produced globally, with each vehicle requiring an average of 0.8 square meters of multilayer PCBs containing CCL and prepreg. Applications such as onboard chargers, inverters, BMS (Battery Management Systems), and ADAS sensors require high thermal conductivity (>1.0 W/m·K), high-Tg (>180°C), and CTI-rated (>600V) laminates. European and Chinese OEMs are increasingly specifying halogen-free, lead-free CCLs with IPC-4101 compliance for eco-design and thermal reliability.

CHALLENGE

Stringent regulatory compliance and performance standards

Meeting evolving industry standards is a major challenge. In 2023, more than 18% of prepreg exports from Southeast Asia failed UL 94 V-0 flame retardancy or ROHS compliance audits in Europe. As OEMs raise performance bars—targeting CAF resistance over 1000 hours and improved heat resistance beyond 350°C Td—CCL manufacturers must invest in new formulations and processing lines. Compliance testing and qualification delays across IPC, UL, and JEDEC standards also extend product commercialization cycles, affecting profitability and speed-to-market.

Copper Clad Laminate (CCL) and Prepreg Market Segmentation

The CCL and prepreg market is segmented by type and application, addressing different performance needs across electronics manufacturing.

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By Type

Copper Clad Laminate (CCL): CCL represents the majority of volume, with over 930 million square meters produced globally in 2023. FR-4 remains the dominant material, followed by BT epoxy, polyimide, and hydrocarbon systems for high-frequency and high-temperature applications. CCL thickness ranges from 0.05 mm to 3.2 mm, with copper foil grades from 9 μm to 70 μm.
Prepreg: Prepreg materials are primarily used for inner-layer bonding in multilayer PCBs. Over 780 million square meters were consumed in 2023, with standard epoxy-glass formats (106, 1080, 2116) dominating. Advanced formulations feature high Tg, low CTE (<60 ppm/°C), and improved resin flow for HDI applications.

By Application

Computer: Servers, desktops, and laptops consumed over 220 million square meters of CCL and prepreg in 2023. Server PCBs required Tg >170°C and loss tangent <0.005.
Communication: Telecom routers, 5G base stations, and switches accounted for more than 200 million square meters, with demand focused on low-Dk, high-frequency laminates.
Consumer Electronics: Smartphones, tablets, and wearables used over 180 million square meters, emphasizing thin, flexible, and low-loss CCLs.
Vehicle Electronics: EVs and autonomous vehicles used more than 130 million square meters, requiring thermal and mechanical stability.
Industrial and Medical: Equipment such as MRI machines and robotics consumed over 90 million square meters, demanding high reliability and signal precision.
Military and Space: High-performance laminates for defense and aerospace applications totaled over 45 million square meters, using high Tg, low Dk prepregs.
Others: Applications in lighting, gaming consoles, and power tools contributed 65 million square meters to market demand.

Copper Clad Laminate (CCL) and Prepreg Market Regional Outlook

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North America

remains a strategic market for high-performance CCL and prepreg materials, particularly in military, aerospace, and server applications. In 2023, the region consumed over 165 million square meters of CCL, with the United States accounting for 140 million square meters. The U.S. is home to major OEMs and defense contractors who demand UL-certified, IPC-4101-classified laminates with extended CAF resistance and thermal endurance. Prepreg usage exceeded 95 million square meters, mainly in data center infrastructure and aerospace radar modules.

Europe’s

demand for advanced laminates is driven by automotive electronics and industrial automation. In 2023, more than 190 million square meters of CCL and 120 million square meters of prepreg were consumed across Germany, France, and the UK. European manufacturers prioritize halogen-free, lead-free laminates compliant with RoHS and REACH. The region also saw increased adoption of prepreg in EV platforms, especially in battery management systems requiring high thermal conductivity and UL94 V-0 classification.

Asia-Pacific

dominates global production and consumption, accounting for over 65% of the total market. China produced more than 600 million square meters of CCL in 2023 and consumed over 500 million square meters domestically. Taiwan, South Korea, and Japan followed, each contributing over 70 million square meters. The region’s demand is centered on consumer electronics, smartphones, 5G telecom infrastructure, and automotive systems. High-speed server and HDI PCB applications are also driving next-gen prepreg development with Df <0.003 and high Tg >180°C.

Middle East & Africa

market is in a nascent stage, with approximately 28 million square meters of CCL and 16 million square meters of prepreg consumed in 2023. The UAE and Saudi Arabia led demand in telecom infrastructure and industrial controls. South Africa, Egypt, and Morocco contributed collectively to about 8 million square meters, primarily in lighting and power distribution. However, lack of local manufacturing and limited regulatory support for advanced electronics restricts broader adoption, creating opportunities for future investment and localized production.

List Of Copper Clad Laminate (CCL) and Prepreg Companies

Kingboard Laminates Group
SYTECH
Panasonic
Nan Ya Plastic
EMC
ITEQ
DOOSAN
TUC
GDM International Technology Ltd.
Hitachi Chemical
Isola
Nanya New Material Technology Co., Ltd.
Rogers Corporation
Wazam New Materials
Chang Chun Group
Mitsubishi
Guangdong Goworld Lamination Plant
Ventec International Group
Sumitomo
AGC

Kingboard Laminates Group: The world’s largest CCL manufacturer, producing over 300 million square meters in 2023. The company maintains a strong presence in China, Taiwan, and Southeast Asia, supplying FR-4 and halogen-free laminates to PCB manufacturers worldwide.

SYTECH: Among the top suppliers globally, SYTECH produced over 240 million square meters of CCL in 2023. The company is known for its dominance in standard FR-4 and low-loss materials for 5G and consumer electronics markets.

Investment Analysis and Opportunities

Investments in the Copper Clad Laminate and Prepreg market are expanding rapidly in response to the digital transformation of mobility, communication, and computing. In 2023 alone, over $1.2 billion was invested in capacity expansion, facility upgrades, and R&D across key regions including China, Taiwan, Germany, and the United States. Kingboard Laminates Group announced an expansion project in Jiangxi Province, China, adding 120 million square meters of annual CCL capacity focused on halogen-free FR-4 and lead-free grades. The $300 million investment includes a resin synthesis line, glass cloth processing, and advanced lamination equipment for ultra-thin copper foil integration. SYTECH allocated over $180 million to increase its capacity by 80 million square meters in Guangdong for high-Tg and low-Dk CCLs used in 5G base stations and electric vehicles. The expansion includes automation of prepreg handling, reducing material defects by 30% and improving resin flow control across variable-weave fabrics. ITEQ, a key player in high-frequency laminates, invested $120 million in Taiwan and Southeast Asia to scale up production of BT epoxy-based CCL and prepreg materials. The new facility is expected to contribute 30 million square meters annually, with a focus on low-loss dielectric performance for server motherboards and mmWave modules. In the United States, Isola committed $75 million to modernize its Arizona plant for aerospace-grade CCLs. The investment targets IPC-4101 class H and military-specified grades with thermal stability exceeding Tg 200°C and UL 94 V-0 compliance. Prepreg output will be increased by 20 million square meters, addressing demand from radar and satellite systems. The European Union’s Green Electronics Program facilitated €60 million in grants to support eco-compliant laminate production across Germany and France. These funds support the development of recyclable and halogen-free prepreg materials with Df <0.004 and Tg above 180°C, suitable for automotive and industrial automation PCBs. Opportunities are also arising in India and Vietnam, where the CCL and prepreg supply chains are expanding to support regional electronics manufacturing. Vietnam saw over $220 million in foreign direct investment for setting up new lamination lines and epoxy resin plants, aimed at producing 50 million square meters annually by 2025. These investments highlight the global strategic push toward higher performance, regulatory compliance, and supply chain localization in the CCL and prepreg ecosystem.

New Product Development

The Copper Clad Laminate (CCL) and Prepreg market has seen a significant wave of innovation aimed at addressing miniaturization, high-speed signal transmission, and environmental compliance. In 2023–2024, over 40 new laminate and prepreg products were launched globally, each targeting specific electronic application needs. Panasonic introduced a next-generation halogen-free CCL designed for 5G antennas and high-speed routers. This product, developed with a unique low-dielectric BT epoxy system, features a dielectric constant of 3.2 and dissipation factor below 0.0025 at 10 GHz. Initial deployment exceeded 15 million square meters, with clients in telecom and high-speed computing. Nan Ya Plastic rolled out a prepreg optimized for automotive radar and infotainment PCBs. The material supports Tg of 185°C, thermal decomposition temperature above 360°C, and CTI above 600V. Over 8 million square meters were supplied to Chinese and European EV makers in 2023, integrated in inverters, BMS, and control units. ITEQ launched its IT-968SE series, a high-performance low-Dk laminate with Df below 0.003 at 28 GHz, designed for mmWave radar and mobile base station applications. This material showed 20% lower insertion loss compared to standard FR-4 in tests and saw more than 10 million square meters shipped across Asia-Pacific in its first three quarters. TUC developed a high-Tg polyimide-based prepreg with UL 94 V-0 and excellent mechanical integrity under flex conditions, targeting rigid-flex PCBs used in foldable smartphones and wearables. The product achieved >1,000 cycles in bend testing without delamination or performance degradation. Over 4.2 million square meters were integrated into consumer electronics by Q1 2024. Rogers Corporation focused on RF-grade CCL with stable dielectric characteristics up to 77 GHz, featuring ceramic-filled hydrocarbon resin systems. These laminates achieved Dk of 2.9 and Df of 0.0015, with over 5.5 million square meters adopted in satellite and defense-grade radar PCBs. Thermal management and compatibility with lead-free assembly processes remain focal points. Over 65% of newly introduced prepregs in 2023 were compatible with reflow profiles up to 260°C, addressing challenges in multilayer assembly for AI servers and GPU modules. Flame-retardant resin systems compliant with halogen-free IPC-4101B/126 standards saw accelerated adoption, especially in the EU. Materials R&D continues to focus on glass-weave effect mitigation, copper adhesion improvements, and resin system chemistry for thinner, faster, and more environmentally compliant electronic substrates.

Five Recent Developments

In June 2023, Kingboard Laminates Group completed a new 120 million square meter capacity line in Jiangxi, targeting halogen-free CCL production.
In August 2023, SYTECH launched a low-loss laminate series for 5G routers with Df <0.0035, reaching 20 million square meters of sales by year-end.
In October 2023, ITEQ introduced IT-968SE laminate for high-frequency telecom applications, with 10 million square meters shipped across Asia.
In December 2023, Panasonic released a next-gen CCL with ultra-low Dk of 3.2, used in over 15 million square meters for 5G and HPC devices.
In March 2024, TUC scaled up its flex-stable prepreg production to meet demand for foldable smartphone PCBs, surpassing 4 million square meters.

Report Coverage of Copper Clad Laminate (CCL) and Prepreg Market

This report offers a comprehensive analysis of the global Copper Clad Laminate (CCL) and Prepreg market, covering performance trends, technology shifts, demand dynamics, regional consumption, and innovation pipelines. It presents a detailed account of production, application segments, and material properties shaping PCB manufacturing globally. The report covers over 25 countries across North America, Europe, Asia-Pacific, and the Middle East, analyzing each region's contribution to total CCL and prepreg consumption. With over 930 million square meters of CCL and 780 million square meters of prepreg used in 2023, the report explores key end-user industries, including telecommunications, automotive, computing, medical devices, aerospace, and consumer electronics. The segmentation includes detailed performance criteria such as dielectric constant (Dk), dissipation factor (Df), glass transition temperature (Tg), decomposition temperature (Td), and compatibility with halogen-free and lead-free requirements. More than 65% of current production is RoHS-compliant, and 55% targets flame retardant and halogen-free standards set by IPC-4101B and UL 94. The report outlines the evolution of high-frequency laminates used in 5G infrastructure, with special emphasis on materials capable of maintaining electrical stability up to 77 GHz and thermal reliability beyond 350°C. It also includes insights into reverse-treated copper foils, resin formulation advances, and semi-additive processes (SAP) now common in HDI PCB manufacturing. Market dynamics include quantified drivers like 5G base station deployment, electric vehicle growth, and server expansion. Restraints such as raw material cost volatility, copper foil shortages, and performance qualification delays are addressed with numerical impact estimates. Opportunities related to the EV sector and industrial IoT growth are mapped with forecasted prepreg consumption in embedded modules. Company profiles provide output volumes, product lines, material properties, and customer application focus areas. Kingboard Laminates and SYTECH are profiled as the two leading companies by production share, with detailed data on facility expansions, regional supply chains, and export strategies. Recent product innovations, material launches, and strategic investments from 2023–2024 are integrated throughout, including over 20 new laminate grades and more than $1.2 billion in announced investments. This report equips engineers, procurement leaders, OEMs, and investors with actionable insight into current and future trends driving the global CCL and prepreg industry.