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This report studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera.
The competition in the underfill industry is intense. There are thousands of manufacturers in this industry. Major manufacturers include Henkel, WON CHEMICAL, Namics, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond etc. The competition status wouldn’t change in the short term. The growth of underfill industry depends on the growth of household appliances, computers and consumer electronics.
Market Analysis and Insights: Global Underfill Market
The global Underfill market was valued at US$ 435.5 in 2020 and will reach US$ 526.1 million by the end of 2027, growing at a CAGR of 3.2% during 2022-2027.
Global Underfill Scope and Market Size
The global Underfill market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Underfill market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.
Segment by Type
Semiconductor Underfills
Board Level Underfills
Segment by Application
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
The Underfill market is analysed and market size information is provided by regions (countries). Segment by Application, the Underfill market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.
By Company
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
U-bond
The competition in the underfill industry is intense. There are thousands of manufacturers in this industry. Major manufacturers include Henkel, WON CHEMICAL, Namics, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond etc. The competition status wouldn’t change in the short term. The growth of underfill industry depends on the growth of household appliances, computers and consumer electronics.
Market Analysis and Insights: Global Underfill Market
The global Underfill market was valued at US$ 435.5 in 2020 and will reach US$ 526.1 million by the end of 2027, growing at a CAGR of 3.2% during 2022-2027.
Global Underfill Scope and Market Size
The global Underfill market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Underfill market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.
Segment by Type
Semiconductor Underfills
Board Level Underfills
Segment by Application
Industrial Electronics
Defense & Aerospace Electronics
Consumer Electronics
Automotive Electronics
Medical Electronics
Others
The Underfill market is analysed and market size information is provided by regions (countries). Segment by Application, the Underfill market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.
By Company
Henkel
WON CHEMICAL
NAMICS
SUNSTAR
Hitachi Chemical
Fuji
Shin-Etsu Chemical
Bondline
AIM Solder
Zymet
Panacol-Elosol
Master Bond
DOVER
Darbond
HIGHTITE
U-bond
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
