Global Through Glass Via (TGV) Technology Market Insights and Forecast to 2028

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
Market Analysis and Insights: Global Through Glass Via (TGV) Technology Market
The global Through Glass Via (TGV) Technology market size is projected to reach US$ 238.4 million by 2028, from US$ 50 million in 2021, at a CAGR of 24.7% during 2022-2028.
Global Through Glass Via (TGV) Technology key players include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, etc. Global top five manufacturers hold a share over 70%.
Asia-Pacific is the largest market, with a share over 15%, followed by Europe, and North America, both have a share over 15 percent.
In terms of product, 300 mm is the largest segment, with a share over 65%. And in terms of application, the largest application is Biotechnology/Medical, followed by Consumer Electronics, etc.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Through Glass Via (TGV) Technology market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Through Glass Via (TGV) Technology market in terms of revenue.
Overall, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Through Glass Via (TGV) Technology market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Through Glass Via (TGV) Technology market.
Global Through Glass Via (TGV) Technology Scope and Market Size
Through Glass Via (TGV) Technology market is segmented by players, region (country), by Type and by Application. Players, stakeholders, and other participants in the global Through Glass Via (TGV) Technology market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
300 mm
200 mm
Less Than 150 mm
Segment by Application
Biotechnology/Medical
Consumer Electronics
Automotive
Others
By Company
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

Frequently Asked Questions