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Thick film ceramic substrate refers to ceramic substrate processed by thick film technology. The thick film ceramic substrate is a post-fired ceramic substrate. "Thick Film" refers to the thickness of conductor layer on Ceramic Substrate. Normally the thickness will be at least exceeds 10 miron (um), around 10~100um, more thick than spurting technology in Thin Film Ceramic Substrate. Of course thickness is less than DCB Ceramic board or FR4 board.
Global Thick Film Ceramic Substrates key players include Maruwa(Japan), Kyocera(Japan), Holy Stone(Taiwan), etc. Global top three manufacturers hold a share over 45%.
Japan is the largest market, with a share about 25%, followed by North America and Europe, both have a share about 40 percent.
In terms of product, Multi Layers is the largest segment, with a share about 75%. And in terms of application, the largest application is Thick Film Circuit, followed by Power Device Substrates.
Market Analysis and Insights: Global Thick Film Ceramic Substrates Market
In 2020, the global Thick Film Ceramic Substrates market size was US$ 507.5 million and it is expected to reach US$ 603.4 million by the end of 2027, with a CAGR of 2.5% between 2021 and 2027
Global Thick Film Ceramic Substrates Scope and Market Size
The global Thick Film Ceramic Substrates market is segmented by region (country), company, by Type, and by Application. Players, stakeholders, and other participants in the global Thick Film Ceramic Substrates market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type, and by Application for the period 2016-2027.
Segment by Type
Single-layer Thick Film Ceramic Substrates
Multilayer Thick Film Ceramic Substrates
Segment by Application
Thick Film Circuit
Power Device Substrates
LED
Others
By Company
Maruwa(Japan)
Tong Hsing(Taiwan)
Kyocera(Japan)
Leatec Fine Ceramics(Taiwan)
Holy Stone(Taiwan)
Nikko(Japan)
CoorsTek(US)
NCI(Japan)
Miyoshi Electronics(Japan)
NEO Tech(US)
Anaren(US)
Micro Systems Engineering GmbH(Germany)
Micro-Precision Technologies(US)
Remtec(US)
ELCERAM(Czech)
KERAFOL Keramische Folien GmbH(Germany)
Best Technology(China)
Noritake (Japan)
Mitsuboshi Belting (Japan)
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Colombia
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Global Thick Film Ceramic Substrates key players include Maruwa(Japan), Kyocera(Japan), Holy Stone(Taiwan), etc. Global top three manufacturers hold a share over 45%.
Japan is the largest market, with a share about 25%, followed by North America and Europe, both have a share about 40 percent.
In terms of product, Multi Layers is the largest segment, with a share about 75%. And in terms of application, the largest application is Thick Film Circuit, followed by Power Device Substrates.
Market Analysis and Insights: Global Thick Film Ceramic Substrates Market
In 2020, the global Thick Film Ceramic Substrates market size was US$ 507.5 million and it is expected to reach US$ 603.4 million by the end of 2027, with a CAGR of 2.5% between 2021 and 2027
Global Thick Film Ceramic Substrates Scope and Market Size
The global Thick Film Ceramic Substrates market is segmented by region (country), company, by Type, and by Application. Players, stakeholders, and other participants in the global Thick Film Ceramic Substrates market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type, and by Application for the period 2016-2027.
Segment by Type
Single-layer Thick Film Ceramic Substrates
Multilayer Thick Film Ceramic Substrates
Segment by Application
Thick Film Circuit
Power Device Substrates
LED
Others
By Company
Maruwa(Japan)
Tong Hsing(Taiwan)
Kyocera(Japan)
Leatec Fine Ceramics(Taiwan)
Holy Stone(Taiwan)
Nikko(Japan)
CoorsTek(US)
NCI(Japan)
Miyoshi Electronics(Japan)
NEO Tech(US)
Anaren(US)
Micro Systems Engineering GmbH(Germany)
Micro-Precision Technologies(US)
Remtec(US)
ELCERAM(Czech)
KERAFOL Keramische Folien GmbH(Germany)
Best Technology(China)
Noritake (Japan)
Mitsuboshi Belting (Japan)
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Colombia
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
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The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
