Global Thick Film Ceramic Substrates Market Report, History and Forecast 2016-2027, Breakdown Data by Manufacturers, Key Regions, Types and Application

SKU ID : QYR- 18724592

Publishing Date : 09-Jul-2021

No. of pages : 136

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  • Thick film ceramic substrate refers to ceramic substrate processed by thick film technology. The thick film ceramic substrate is a post-fired ceramic substrate. "Thick Film" refers to the thickness of conductor layer on Ceramic Substrate. Normally the thickness will be at least exceeds 10 miron (um), around 10~100um, more thick than spurting technology in Thin Film Ceramic Substrate. Of course thickness is less than DCB Ceramic board or FR4 board.
    Global Thick Film Ceramic Substrates key players include Maruwa(Japan), Kyocera(Japan), Holy Stone(Taiwan), etc. Global top three manufacturers hold a share over 45%.
    Japan is the largest market, with a share about 25%, followed by North America and Europe, both have a share about 40 percent.
    In terms of product, Multi Layers is the largest segment, with a share about 75%. And in terms of application, the largest application is Thick Film Circuit, followed by Power Device Substrates.

    Market Analysis and Insights: Global Thick Film Ceramic Substrates Market
    In 2020, the global Thick Film Ceramic Substrates market size was US$ 507.5 million and it is expected to reach US$ 603.4 million by the end of 2027, with a CAGR of 2.5% between 2021 and 2027
    Global Thick Film Ceramic Substrates Scope and Market Size
    The global Thick Film Ceramic Substrates market is segmented by region (country), company, by Type, and by Application. Players, stakeholders, and other participants in the global Thick Film Ceramic Substrates market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type, and by Application for the period 2016-2027.

    Segment by Type
    Single-layer Thick Film Ceramic Substrates
    Multilayer Thick Film Ceramic Substrates

    Segment by Application
    Thick Film Circuit
    Power Device Substrates
    LED
    Others

    By Company
    Maruwa(Japan)
    Tong Hsing(Taiwan)
    Kyocera(Japan)
    Leatec Fine Ceramics(Taiwan)
    Holy Stone(Taiwan)
    Nikko(Japan)
    CoorsTek(US)
    NCI(Japan)
    Miyoshi Electronics(Japan)
    NEO Tech(US)
    Anaren(US)
    Micro Systems Engineering GmbH(Germany)
    Micro-Precision Technologies(US)
    Remtec(US)
    ELCERAM(Czech)
    KERAFOL Keramische Folien GmbH(Germany)
    Best Technology(China)
    Noritake (Japan)
    Mitsuboshi Belting (Japan)

    By Region
    North America
    United States
    Canada
    Europe
    Germany
    France
    U.K.
    Italy
    Russia
    Asia-Pacific
    China
    Japan
    South Korea
    Southeast Asia
    India
    Australia
    Taiwan
    Indonesia
    Thailand
    Malaysia
    Latin America
    Mexico
    Brazil
    Colombia
    Argentina
    Middle East & Africa
    Turkey
    Saudi Arabia
    UAE


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    This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.

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