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In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The Solder Ball industry can be broken down into several segments, Lead Solder Ball and Lead Free Solder Ball.
Across the world, the major players cover Senju Metal, DS HiMetal, etc.
Market Analysis and Insights: Global Solder Ball Market
Due to the COVID-19 pandemic, the global Solder Ball market size is estimated to be worth US$ 252.2 million in 2021 and is forecast to a readjusted size of US$ 252.2 million by 2028 with a CAGR of 6.5% during the review period. Fully considering the economic change by this health crisis, by Type accounting for % of the Solder Ball global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While by Type segment is altered to an % CAGR throughout this forecast period.
Asia Pacific held the leading share of the market in terms of revenue. We estimate that the global market share of Solder Ball is 27% in Taiwan, 20% in Korea, 17% in Japan, 15% in China and 10% in South East Asia.
Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market. Senju Metal dominated with 40% revenue share, followed by DS HiMetal with 19% revenue share and MKE with 7% revenue share.
Global Solder Ball Scope and Market Size
The global Solder Ball market is segmented by company, region (country), by Type and by Application. Players, stakeholders, and other participants in the global Solder Ball market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
Segment by Type
Lead Solder Ball
Lead Free Solder Ball
Segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
By Region
United States
Europe
China
Japan
Southeast Asia
India
Other Regions
By Company
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The Solder Ball industry can be broken down into several segments, Lead Solder Ball and Lead Free Solder Ball.
Across the world, the major players cover Senju Metal, DS HiMetal, etc.
Market Analysis and Insights: Global Solder Ball Market
Due to the COVID-19 pandemic, the global Solder Ball market size is estimated to be worth US$ 252.2 million in 2021 and is forecast to a readjusted size of US$ 252.2 million by 2028 with a CAGR of 6.5% during the review period. Fully considering the economic change by this health crisis, by Type accounting for % of the Solder Ball global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While by Type segment is altered to an % CAGR throughout this forecast period.
Asia Pacific held the leading share of the market in terms of revenue. We estimate that the global market share of Solder Ball is 27% in Taiwan, 20% in Korea, 17% in Japan, 15% in China and 10% in South East Asia.
Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market. Senju Metal dominated with 40% revenue share, followed by DS HiMetal with 19% revenue share and MKE with 7% revenue share.
Global Solder Ball Scope and Market Size
The global Solder Ball market is segmented by company, region (country), by Type and by Application. Players, stakeholders, and other participants in the global Solder Ball market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
Segment by Type
Lead Solder Ball
Lead Free Solder Ball
Segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
By Region
United States
Europe
China
Japan
Southeast Asia
India
Other Regions
By Company
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material
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This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
