Global Solder Ball Packaging Material Market Insights and Forecast to 2028

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

Market Analysis and Insights: Global Solder Ball Packaging Material Market
Due to the COVID-19 pandemic, the global Solder Ball Packaging Material market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted size of US$ million by 2028 with a CAGR of % during the review period. Fully considering the economic change by this health crisis, Lead Solder Ball accounting for % of the Solder Ball Packaging Material global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While BGA segment is altered to an % CAGR throughout this forecast period.
China Solder Ball Packaging Material market size is valued at US$ million in 2021, while the US and Europe Solder Ball Packaging Material are US$ million and US$ million, severally. The proportion of the US is % in 2021, while China and Europe are % and % respectively, and it is predicted that China proportion will reach % in 2028, trailing a CAGR of % through the analysis period. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR %, %, and % respectively for the next 6-year period. As for the Europe Solder Ball Packaging Material landscape, Germany is projected to reach US$ million by 2028 trailing a CAGR of % over the forecast period.
The global key manufacturers of Solder Ball Packaging Material include Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material and Shenmao Technology, etc. In 2021, the global top five players have a share approximately % in terms of revenue.
In terms of production side, this report researches the Solder Ball Packaging Material capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Solder Ball Packaging Material by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Solder Ball Packaging Material Scope and Segment
Solder Ball Packaging Material market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Solder Ball Packaging Material market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Lead Solder Ball
Lead Free Solder Ball
Segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others
By Company
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Indium Corporation
Jovy Systems
Production by Region
North America
Europe
China
Japan
Korea
Taiwan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E

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