Global Single Sided FPC Coverlay Market Research Report 2024

SKU ID : QYR-27706477

No. of pages : 100

Publishing Date : 21-Jun-2024

Single-sided FPC, also called single-layer FPC, means that only one side of the printed circuit board is “printed” with electronic circuits with conductive materials. It using single-sided PI copper clad laminate, generally rolled copper foil, chemically etched conductive patterns, and then covered with a layer of covering film after the circuit is completed (strictly speaking, single-sided flexible PCB can be manufactured with or without With a cover layer or other protective coating. The cover layer or protective layer plays the role of protecting the circuit, usually located on the “top layer” of the flexible circuit), forming a flexible circuit board with only a single layer of conductors.

The global Single Sided FPC Coverlay market was valued at US$ 453 million in 2023 and is anticipated to reach US$ 674.6 million by 2030, witnessing a CAGR of 5.8% during the forecast period 2024-2030.

Single-sided flexible circuit board cover film is a kind of covering material used in the manufacture of flexible circuit boards. Flexible circuit board is a circuit board made of flexible substrate, which has good flexibility and bendability, and is suitable for applications that require curved surface design or space constraints. The cover film is a layer of material used to protect the circuit lines, connectors and components of the flexible circuit board to prevent the circuit from being exposed to the external environment. Single-sided flexible circuit board cover film refers to the covering material used on one side of the flexible circuit board. It is usually a polymer film, such as polyimide (PI) film, which has insulating properties and high temperature resistance. The cover film can wrap the circuit lines and connection points to prevent physical damage and the influence of the external environment. Coverlays have insulating properties that provide electrical isolation between circuits. A cover film can add mechanical strength to a flex circuit board, making it more durable and able to withstand bending and folding. The cover film can also cover the pads to prevent the molten material from contaminating the circuit during soldering.

This report aims to provide a comprehensive presentation of the global market for Single Sided FPC Coverlay, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Single Sided FPC Coverlay.

Report Scope

The Single Sided FPC Coverlay market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Single Sided FPC Coverlay market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Single Sided FPC Coverlay manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation


By Company


DuPont

Namics

Henkel

Hanwha Solutions

Dexerials

Taiflex

ITEQ Corporation

Arisawa Mfg

INNOX Advanced Materials

Panasonic

Microcosm Technology


Segment by Type


Yellow Coverlay

Black Coverlay

Others


Segment by Application


Consumer Mobile Products

Medical

Industrial

Avionics

Others


Production by Region



North America

Europe

China

Japan

South Korea


Consumption by Region


North America

United States

Canada

Europe

Germany

France

U.K.

Italy

Russia

Asia-Pacific

China

Japan

South Korea

China Taiwan

Southeast Asia

India

Latin America, Middle East & Africa

Mexico

Brazil

Turkey

GCC Countries

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Detailed analysis of Single Sided FPC Coverlay manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Production/output, value of Single Sided FPC Coverlay by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.

Chapter 4: Consumption of Single Sided FPC Coverlay in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.

Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: The main points and conclusions of the report.


Frequently Asked Questions



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