Global Quad-Flat-No-Lead Packaging(QFN) Market Research Report 2021 - Impact of COVID-19 on the Market

SKU ID : Maia- 19311928

Publishing Date : 12-Oct-2021

No. of pages : 122

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  • Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB.Flat no-lead packages include an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad.The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA).
    The Quad-Flat-No-Lead Packaging(QFN) market revenue was xx Million USD in 2016, grew to xx Million USD in 2021, and will reach xx Million USD in 2026, with a CAGR of xx during 2021-2026.

    Considering the influence of COVID-19 on the global Quad-Flat-No-Lead Packaging(QFN) market, this report analyzed the impact from both global and regional perspectives. From production end to consumption end in regions such as North America, Europe, China, and Japan, the report put emphasis on analysis of market under COVID-19 and corresponding response policy in different regions.

    This report also analyzes the strategies for different companies to deal with the impact of COVID-19 in detail to seek a path to recovery.

    Under COVID-19 Outbreak, how the Quad-Flat-No-Lead Packaging(QFN) Industry will develop is also analyzed in detail in Chapter 1.8 of this report.

    Major Players in Quad-Flat-No-Lead Packaging(QFN) market are:
    Fujitsu Ltd
    Amkor Technology
    UTAC Group
    STATS ChipPAC Pte. Ltd
    ASE Industrial Holding, Co., Ltd.
    Linear Technology Corporation
    Microchip Technology Inc
    NXP Semiconductor
    Texas Instruments

    Most important types of Quad-Flat-No-Lead Packaging(QFN) products covered in this report are:
    Air-Cavity QFNs
    Plastic Molded QFNs

    Most widely used downstream fields of Quad-Flat-No-Lead Packaging(QFN) market covered in this report are:
    Portable Devices
    Radio Frequency (RF)
    Wearable Devices
    Others

    Major Region

    s or countries covered in this report:
    North America
    Europe
    China
    Japan
    Middle East and Africa
    South America
    India
    South Korea
    Southeast Asia
    Others

    In Chapter 3.4, the report provides analysis of the reasons behind price fluctuations.

    In chapters 5, 6, and 7, the impact of COVID-19 on the different regions in both production and consumption end and SWOT analysis are pointed out.

    In Chapters 8, the report presents company's recent development and strategies to deal with the impact of COVID-19.

    Years considered for this report:


    Historical Years:

    2016-2020

    Base Year:

    2020

    Estimated Year:

    2021

    Forecast Period:

    2021-2026

    Frequently Asked Questions



    This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.

    • By product type
    • By End User/Applications
    • By Technology
    • By Region

    The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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