Global Power Module Packaging Market Study 2016-2026, by Segment (GaN Module, FET Module, … …), by Market (Wind Turbines, Rail Tractions, … …), by Company (IXYS Corporation, Star Automations, … …)

SKU ID : 99ST- 14091720

Publishing Date : 28-Oct-2019

No. of pages : 58

PRICE
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3600


  • Summary

    The global Power Module Packaging market will reach Volume Million USD in 2019 and with a CAGR xx% between 2020-2026.

    Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):


    GaN Module
    FET Module
    IGBT Module
    SiC Module
    Demand Coverage (Market Size & Forecast, Consumer Distribution):
    Wind Turbines
    Rail Tractions
    Motors
    Electric Vehicles
    Photovoltaic Equipments
    Others

    Company Coverage (Sales data, Main Products & Services etc.):


    IXYS Corporation
    Star Automations
    DyDac Controls
    SEMIKRON
    Mitsubishi Electric Corporation
    Texas Instruments Incorporated
    Sanken Electric Co., Ltd.
    Fuji Electric Co. Ltd.
    Infineon Technologies AG
    SanRex Corporation

    Major Region

    Market
    North America
    Europe
    Asia-Pacific
    South America
    Middle East & Africa