Global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market 2018 by Manufacturers, Regions, Type and Application, Forecast to 2023

SKU ID : GIR- 12241742

Publishing Date : 10-Sep-2018

No. of pages : 145

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  • Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.



    Scope of the Report:

    This report focuses on the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

    Most PCB manufacturers are finding the demand for multilayer boards increasing by leaps and bounds. This growing demand is fed by the need for smaller, lighter boards for use in electrical devices, military equipment, healthcare miniaturization, and an expanding market for smart devices incorporated in home automation systems.
    Smartphones and computers are perfect applications for multilayer PCBs with their need for compactness and light weight, yet sophisticated functionality.
    Within the PCB market, the communication industry is expected to remain the largest market. Continuous innovations in smartphones and increasing demand from emerging economies are expected to spur growth for this segment over the forecast period.

    The worldwide market for Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) is expected to grow at a CAGR of roughly 1.9% over the next five years, will reach 25700 million US$ in 2023, from 23000 million US$ in 2017, according to a new study.



    Market Segment by Manufacturers, this report covers

    Nippon Mektron

    ZD Tech

    TTM Technologies

    Unimicron

    Sumitomo Denko

    Compeq

    Tripod

    Samsung E-M

    Young Poong Group

    HannStar

    Ibiden

    Nanya PCB

    KBC PCB Group

    Daeduck Group

    AT&S

    Fujikura

    Meiko

    Multek

    Kinsus

    Chin Poon

    T.P.T.

    Shinko Denski

    Wus Group

    Simmtech

    Mflex

    CMK

    LG Innotek

    Gold Circuit

    Shennan Circuit

    Ellington

    Kinwong

    Founder Tech

    Dynamic

    Aoshikang

    Wuzhou

    CCTC

    SZ Fast Print

    Guangdong Xinda

    Shenzhen Suntak

    Redboard



    Market Segment by Regions, regional analysis covers

    North America (United States, Canada and Mexico)

    Europe (Germany, France, UK, Russia and Italy)

    Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

    South America (Brazil, Argentina, Colombia etc.)

    Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)



    Market Segment by Type, covers

    Layer 4-6

    Layer 8-10

    Layer 10+



    Market Segment by Applications, can be divided into

    Consumer Electronics

    Communications

    Computer Related Industry

    Automotive Industry

    Other



    There are 15 Chapters to deeply display the global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market.

    Chapter 1, to describe Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Introduction, product scope, market overview, market opportunities, market risk, market driving force;

    Chapter 2, to analyze the top manufacturers of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board), with sales, revenue, and price of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board), in 2016 and 2017;

    Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;

    Chapter 4, to show the global market by regions, with sales, revenue and market share of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board), for each region, from 2013 to 2018;

    Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;

    Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;

    Chapter 12, Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;

    Chapter 13, 14 and 15, to describe Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source


    Frequently Asked Questions



    This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.

    • By product type
    • By End User/Applications
    • By Technology
    • By Region

    The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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