Global Chip Packaging Market Size, Status and Forecast 2021-2027

Chip packaging mainly installed semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the bridge of the internal and external communication chip circuit, chip the contacts with wire is connected to the encapsulation of shell on the pins of the pins and wires on the PCB and other devices connected.
Therefore, encapsulation plays an important role in Cpus and other LSI integrated circuits.
The chip packaging technology has gone through several generations of changes, from DIP, QFP, PGA, BGA, CSP to MCM. The technical indicators are more and more advanced from generation to generation, including the ratio of chip area to package area getting closer to 1, the application frequency getting higher and higher, and the temperature resistance performance getting better and better.
More pins, less pin spacing, less weight, more reliability, more convenience, etc
According to the type breakdown, all markets for chip packaging can be divided into the following categories:
The first category is mainly traditional packaging, which has a relatively large share of the global market, accounting for about 55.95% in 2019.
The other major category is advanced packaging. For many companies, advanced packaging technology is very attractive. Advanced packaging technology is the core of all semiconductor manufacturing processes today.
For all semiconductor companies, advanced packaging technology is responding to major trends such as 5G, artificial intelligence and the Internet of Things.
Advanced packaging will account for 45.33% of the market by 2020.
From a regional perspective, The market share of Taiwan's market output value in 2019 is relatively large, accounting for 44.76% of the market, which will maintain steady growth in the next few years.
With a market share of 34.62% in terms of output, China and 11.23% in terms of output, the U.S. will continue to play an important role that cannot be ignored.
Any change in China or Taiwan could affect the trend in chip packaging.
Japan, the rest of the Asia-Pacific region and other countries/regions also play an important role in the global market, but their market share will be lower in certain regions.
The chip packaging market consists of a group of well-known brand manufacturers and new entrants.
The world's leading players in the chip packaging market are Ase, Anyou technology, Changdian Technology, Spil, Lisheng Technology, Tonfu Microelectronics, Tianshui Huatian, United Technology, Qibang Technology, Hana Micron, etc.
These top 10 companies now account for more than 78 per cent of the total market share and are expected to maintain their dominance over the forecast period.
As consumer interest increases, this market will attract other major companies that want to expand their brand equity.

Market Analysis and Insights: Global Chip Packaging Market
The global Chip Packaging market size is projected to reach US$ 4319.1 million by 2027, from US$ 2740 million in 2020, at a CAGR of 6.7% during 2021-2027.
With industry-standard accuracy in analysis and high data integrity, the report makes a brilliant attempt to unveil key opportunities available in the global Chip Packaging market to help players in achieving a strong market position. Buyers of the report can access verified and reliable market forecasts, including those for the overall size of the global Chip Packaging market in terms of revenue.
On the whole, the report proves to be an effective tool that players can use to gain a competitive edge over their competitors and ensure lasting success in the global Chip Packaging market. All of the findings, data, and information provided in the report are validated and revalidated with the help of trustworthy sources. The analysts who have authored the report took a unique and industry-best research and analysis approach for an in-depth study of the global Chip Packaging market.

Global Chip Packaging Scope and Market Size
Chip Packaging market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Chip Packaging market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.

Segment by Type
Traditional Packaging
Advanced Packaging

Segment by Application
Motor Vehicles and Transport
Consumer Electronics
Communication
Other

By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Nordic
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

By Company
ASE
Amkor
JCET Group
Spil
Pti
Tongfu Microelectronics Co., Ltd.
Tianshui Huatian Technology Co., LTD
UTAC Holdings Ltd
Chipbond Technology Corporation
Hana Micron
Huatai electronics
East China Science and Technology Co. LTD
NEPES
Unisem
ChipMOS Technologies
Signitec
Carsem
King Yuan Electronics CO., LTD.

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