Global Chip On Flex (COF) Market Size, Manufacturers, Supply Chain, Sales Channel and Clients, 2020-2026

Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn't have to go through all the traditional assembly steps required for individual IC packaging. This simplifies the over-all process of designing and manufacturing the final product while improving its performance as a result of the shorter interconnection paths.
COF is the role of product through the flexible substrate and connected to on-chip liquid crystal panel, the liquid crystal panel and the control chip driver current, voltage, thus changing the state of the liquid crystal display different screens. Currently, COF products are widely used in LCD TVs, smart 3G phones and laptop computers and other products with LCD display driver.

Market Analysis and Insights: Global Chip On Flex (COF) Market
In 2019, the global Chip On Flex (COF) market size was US$ 1634.9 million and it is expected to reach US$ 2232.5 million by the end of 2026, with a CAGR of 4.5% during 2021-2026.
Global Chip On Flex (COF) Scope and Market Size
Chip On Flex (COF) market is segmented by region, by country, company, type, application and by sales channels. Players, stakeholders, and other participants in the global Chip On Flex (COF) market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region, by country, company, type, application and by sales channels for the period 2015-2026.

Segment by Type, the Chip On Flex (COF) market is segmented into
Single sided COF
Others

Segment by Application, the Chip On Flex (COF) market is segmented into
Military
Medical
Aerospace
Electronics
Other

Regional and Country-level Analysis:
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
India
Southeast Asia
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA

Competitive Landscape

and Chip On Flex (COF) Market Share Analysis
Chip On Flex (COF) market competitive landscape provides details and data information by companies. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on sale and revenue by players for the period 2015-2020. Details included are company description, major business, Chip On Flex (COF) product introduction, recent developments, Chip On Flex (COF) sales by region, type, application and by sales channel.

The major companies include:
LGIT
Stemco
Flexceed
Chipbond Technology
CWE
Danbond Technology
AKM Industrial
Compass Technology Company
Compunetics
STARS Microelectronics

Frequently Asked Questions