Global Back Grinding Tapes (BGT) Market Report, History and Forecast 2017-2028, Breakdown Data by Manufacturers, Key Regions, Types and Application

BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling.
Market Analysis and Insights: Global Back Grinding Tapes (BGT) Market
Due to the COVID-19 pandemic, the global Back Grinding Tapes (BGT) market size is estimated to be worth US$ 207.6 million in 2021 and is forecast to a readjusted size of US$ 299.3 million by 2028 with a CAGR of 5.3% during the forecast period 2022-2028.
The global main manufacturers of Back Grinding Tapes (BGT) include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X and AI Technology, etc. In 2021, the global six largest players have a share approximately % in terms of revenue.
The North America Back Grinding Tapes (BGT) market is estimated at US$ million in 2021, while China is forecast to reach US$ million by 2028. The proportion of the China is % in 2021 and it is predicted that the share will reach % in 2028, trailing a CAGR of % through the analysis period 2022-2028. As for the Europe Back Grinding Tapes (BGT) landscape, Germany is projected to reach US$ million by 2028. and in Asia, the notable markets are Japan and South Korea, CAGR is % and % respectively for the next 6-year period.
UV Type accounting for % of the Back Grinding Tapes (BGT) global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR from 2022 to 2028. While Standard segment is altered to an % CAGR throughout this forecast period and will hold a share about % in 2028.
Global Back Grinding Tapes (BGT) Scope and Market Size
The global Back Grinding Tapes (BGT) market is segmented by region (country), company, by Type and by Application. Players, stakeholders, and other participants in the global Back Grinding Tapes (BGT) market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
Segment by Type
UV Type
Non-UV Type
Segment by Application
Standard
Standard Thin Die
(S)DBG (GAL)
Bump
By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

Frequently Asked Questions