Global Anisotropic Conductive Film Market Insights and Forecast to 2027

Anisotropic conductive film (ACF), is a lead-free and environmentally friendly adhesive interconnect system that is commonly used in liquid crystal display manufacturing to make the electrical and mechanical connections from the driver electronics to the glass substrates of the LCD.
Anisotropic conductive adhesives are prepared in two forms: films and pastes. In the film form, Anisotropic conductive adhesives are called Anisotropic conductive film (ACF), while they are known as anisotropic conductive pest (ACP) in the paste form. This report studies the Anisotropic conductive film (ACF) market, from angles of Company, regions, product types and end industries, to analyze the status and the future.
The Anisotropic Conductive Film market covers Chip on Glass, Chip on Flex, Chip on Board, Flex on Glass, Flex on Flex, Flex on Board, etc. The typical players include Hitachi Chemical, Dexerials, 3M, H&SHighTech, Btech Corp (ADA Technologies, Inc.), Tesa Tape, U-PAK, etc.
The industry's leading producers are Hitachi Chemical and Dexerials, which account for 59.11 percent and 9.49 percent of revenues respectively. By region, the Asia-Pacific region has the highest share of income, with more than 49 percent in 2019.

Market Analysis and Insights: Global Anisotropic Conductive Film Market
The global Anisotropic Conductive Film market is valued at US$ 511.1 million in 2019. The market size will reach US$ 749.3 million by the end of 2026, growing at a CAGR of 6.0% during 2021-2026.

Global Anisotropic Conductive Film Scope and Segment
Anisotropic Conductive Film market is segmented by Type, and by Downstream Market. Players, stakeholders, and other participants in the global Anisotropic Conductive Film market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Downstream Market for the period 2016-2027.

Segment by Type
Chip on Glass
Chip on Flex
Chip on Board
Flex on Glass
Flex on Flex
Flex on Board
The COG segment was estimated to account for the major market share of about 29.33% in 2019.

Segment by Downstream Market
Displays
Automotive
Aerospace
Electronic Components
Others
Diaplays occupied the major market share of about 62.82% in 2019.

By Company
Hitachi Chemical
Dexerials
3M
H&SHighTech
Btech Corp (ADA Technologies, Inc.)
Tesa Tape
U-PAK

Production by Region
North America
Japan
South Korea
Taiwan (China)
Southeast Asia

Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E

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