Global and United States Chemical Mechanical Planarization Market Report & Forecast 2022-2028

Chemical Mechanical Planarization (CMP) is a polishing process, which utilizes a chemical slurry formulation and mechanical polishing process to remove unwanted conductive or dielectric materials on the silicon wafer, achieving a near-perfect flat and smooth surface upon which layers of integrated circuitry are built. The report covers the CMP equipment and CMP consumable (slurry, pad, pad conditioner and others).
Market Analysis and Insights: Global and United States Chemical Mechanical Planarization Market
This report focuses on global and United States Chemical Mechanical Planarization market, also covers the segmentation data of other regions in regional level and county level.
Due to the COVID-19 pandemic, the global Chemical Mechanical Planarization market size is estimated to be worth US$ 5411 million in 2022 and is forecast to a readjusted size of US$ 7895.4 million by 2028 with a CAGR of 6.5% during the review period. Fully considering the economic change by this health crisis, by Type, CMP Equipment accounting for % of the Chemical Mechanical Planarization global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While by Application, IC Manufacturing was the leading segment, accounting for over percent market share in 2021, and altered to an % CAGR throughout this forecast period.
In United States the Chemical Mechanical Planarization market size is expected to grow from US$ million in 2021 to US$ million by 2028, at a CAGR of % during the forecast period.
Global Chemical Mechanical Planarization Scope and Market Size
Chemical Mechanical Planarization market is segmented by region (country), players, by Type and by Application. Players, stakeholders, and other participants in the global Chemical Mechanical Planarization market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application for the period 2017-2028.
For United States market, this report focuses on the Chemical Mechanical Planarization market size by players, by Type and by Application, for the period 2017-2028. The key players include the global and local players, which play important roles in United States.
Segment by Type
CMP Equipment
CMP Slurries
CMP Pad
CMP Pad Conditioners
Others
Segment by Application
IC Manufacturing
MEMS & NEM
Optics
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
By Company
DuPont
Ebara
Cabot Microelectronics
Applied Materials
Hitachi Chemical
Merck KGaA (Versum Materials)
Fujifilm
Fujimi
3M
Entegris
FUJIBO
Anji Microelectronics
Saesol
AGC

Frequently Asked Questions