Global Aluminum Bonding Wires Market Insights and Forecast to 2028

Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.
Aluminum wire bonding is a process similar to gold wire bonding but with the critical distinction that the surface does not need to be heated to 150°C or even anything above room temperature. Force and ultrasonics are vital to the formation of aluminum bonds. The creation of an aluminum wire bond is the same as for gold wire, which consists of two attachment points and a specific loop shape. During the attachment steps for the wire, the only factors needed for the bond are force and ultrasonics, as the surface does not need to be heated.
Aluminum bonding wire, like gold wire, provides a strong electrical path for connections between components in an assembly but has some key advantages. Aluminum bonding allows for interconnections to be formed on temperature-sensitive assemblies where the materials cannot withstand the temperatures usually required for gold bonding. Aluminum wire is also much preferred over gold wire on Aluminum surfaces in hermetically sealed packages as the temperatures needed for hermetic sealing can compromise the integrity of Au on Al bonds.
Market Analysis and Insights: Global Aluminum Bonding Wires Market
Due to the COVID-19 pandemic, the global Aluminum Bonding Wires market size is estimated to be worth US$ 175.2 million in 2022 and is forecast to a readjusted size of US$ 252.8 million by 2028 with a CAGR of 6.3% during the review period. Fully considering the economic change by this health crisis, Small Diameter Aluminum Wires accounting for % of the Aluminum Bonding Wires global market in 2021, is projected to value US$ million by 2028, growing at a revised % CAGR in the post-COVID-19 period. While Automotive Electronics segment is altered to an % CAGR throughout this forecast period.
Global Aluminum Bonding Wires main manufactuers include Heraeus, Tanaka, Custom Chip Connections and World Star Electronic Material, totally accounting for 30% of the market. China is the largest market, with a share over 40%. As for the types of products, it can be divided into small diameter aluminum wires and large diameter aluminum wires. The most common type is small diameter aluminum wires, with a share over 68%. In terms of application, it is widely used in automotive electronics, consumer electronics, power supplies, computing equipment industry and military and aerospace. The most common application isautomotive electronics, which accounts for 23% of all.
In terms of production side, this report researches the Aluminum Bonding Wires capacity, production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Aluminum Bonding Wires by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Aluminum Bonding Wires Scope and Segment
Aluminum Bonding Wires market is segmented by Type and by Application. Players, stakeholders, and other participants in the global Aluminum Bonding Wires market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2017-2028.
Segment by Type
Small Diameter Aluminum Wires
Large Diameter Aluminum Wires
Segment by Application
Automotive Electronics
Consumer Electronics
Power Supplies
Computing Equipment
Industrial
Military & Aerospace
Others
By Company
Heraeus
Tanaka
Custom Chip Connections
World Star Electronic Material Co.,Ltd.
Ametek
Nichetech
Holdwell
Yantai YesNo Electronic Materials
Production by Region
North America
Europe
Southeast Asia
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE

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