Global 3D Time-of-flight Image Sensors Market Insights, Forecast to 2025

3D time-of-flight (ToF) sensor is part of the 3D ToF image sensor family. The device combines ToF sensing with an optimally-designed analog-to-digital converter (ADC) and a versatile, programmable timing generator (TG).

The built-in TG controls the reset, modulation, readout, and digitization sequence. The programmability of the TG offers flexibility to optimize for various depth-sensing performance.
On the basis of type, the 3D Time-of-flight Image Sensor market is segmented into Half-QQVGA ToF Image Sensor, QVGA ToF Image Sensor, and Others. The QVGA ToF Image Sensor segment is expected to account for the larger share of the global market in 2017.
End-users, included in this market are Consumer Electronics, Robotics and Drone, Machine Vision and Industrial Automation, Entertainment, Automobile, and Others usage. The Consumer Electronics application is expected to account for the largest share of the global market in 2017.
Based on regions, the global 3D Time-of-flight Image Sensor market is segmented into North America, Europe, China, Japan, Korea, Asia Other, and the Rest of the World (ROW). USA and Europe is expected to account for larger share and China is growing fastest of the market during the forecast period.
The 3D Time-of-flight Image Sensors market was valued at 620 Million US$ in 2018 and is projected to reach 2670 Million US$ by 2025, at a CAGR of 20.0% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D Time-of-flight Image Sensors.

This report presents the worldwide 3D Time-of-flight Image Sensors market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

The following manufacturers are covered in this report:
Texas Instruments
STMicroelectronics
PMD Technologies
Infineon
PrimeSense (Apple)
MESA (Heptagon)
Melexis
ifm Electronic
Canesta (Microsoft)
Espros Photonics
TriDiCam

3D Time-of-flight Image Sensors Breakdown Data by Type
Half-QQVGA ToF Image Sensor
QVGA ToF Image Sensor
Others
3D Time-of-flight Image Sensors Breakdown Data by Application
Consumer Electronics
Robotics and Drone
Machine Vision and Industrial Automation
Entertainment
Automobile
Others

3D Time-of-flight Image Sensors Production by Region
United States
Europe
China
Japan
South Korea
Other Regions

3D Time-of-flight Image Sensors Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa

The study objectives are:
To analyze and research the global 3D Time-of-flight Image Sensors status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key 3D Time-of-flight Image Sensors manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

In this study, the years considered to estimate the market size of 3D Time-of-flight Image Sensors :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025

This report includes the estimation of market size for value (million USD) and volume (K Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of 3D Time-of-flight Image Sensors market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.

For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Frequently Asked Questions