China 3D IC and 2.5D IC Packaging Market Research Report 2018

SKU ID : QYR- 11061630

Publishing Date : 02-Feb-2018

No. of pages : 96

PRICE
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  • The global 3D IC and 2.5D IC Packaging market is valued at XX million USD in 2016 and is expected to reach XX million USD by the end of 2022, growing at a CAGR of XX% between 2016 and 2022.

    China plays an important role in global market, with market size of xx million USD in 2016 and will be xx million USD in 2022, with a CAGR of xx%.

    This report studies the 3D IC and 2.5D IC Packaging development status and future trend in China, focuses on top players in China, also splits 3D IC and 2.5D IC Packaging by type and by applications, to fully and deeply research and reveal the market general situation and future forecast.

    The major players in China market include
    Taiwan Semiconductor
    Samsung Electronics
    Toshiba Corp
    Advanced Semiconductor Engineering
    Amkor Technology
    ...

    Geographically, this report splits the China market into six regions,
    South China
    East China
    Southwest China
    Northeast China
    North China
    Central China
    Northwest China

    On the basis of product, this report displays the sales volume (Units), revenue (Million USD), product price (K USD/Unit), market share and growth rate of each type, primarily split into
    3D wafer-level chip-scale packaging
    3D TSV
    2.5D

    On the basis of the end users/application, this report covers
    Logic
    Imaging & optoelectronics
    Memory
    MEMS/sensors
    LED
    Power

    If you have any special requirements, please let us know and we will offer you the report as you want.