Asia-Pacific Semiconductor Packaging and Assembly (P&A) Equipment Market: Insights and Forecast 2018-2025: Emphasis on Process Type (Plating, Inspection and Dicing, Wire Bonding, Die-Bonding, Others (Including Packaging)), Application (Consumer Elect

SKU ID : UMI- 13270231

Publishing Date : 01-Mar-2019

No. of pages : 110

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  • The Asia-Pacific Semiconductor packaging and assemble equipment market is anticipated to grow at a CAGR of 5.6% during the analysed period 2019-2025. Increase use of semiconductor chip in daily used equipment’s are the major factor driving the market. Semiconductors form the foundation of all the electronics that we use in our daily lives. From alarm clock to microwave to the cell phone and laptop that enable our workday, most of the things in our surrounding are powered by semiconductor chips. The Asia Pacific is the biggest semiconductor industry across the globe and it is growing rapidly owing to the high penetration of integrated semiconductor chips across all the industry verticals. The increasing usage of semiconductor integrated chip across several industry segments like mobile and consumer electronic devices, automobiles, medical equipment, high definition television, and laptops has increased the requirement of packaging and assembly equipment. The presence of many major players in the Asian region further boosts the market. The Internet of Things and automation in automobiles have boosted the semiconductor market which in return propels the packaging and assembling equipment industry in Asian countries. The usage of semiconductor ICs for automated driving, automatic braking system, GPS, power doors and windows bring high potential in the market. However, the requirement of heavy investments, trade war and fluctuating foreign exchange rates are hampering the market. Inspite of this, the favourable government policies and increasing usage of automation in countries such as China and Taiwan are anticipated to be a key opportunity areas for the players in the industry.

    “Owing to the increase in demand of advanced electronics due to growing electrification and automation of automobiles, automotive application segment is anticipated to show a remarkable CAGR during the forecast period”
    The semiconductor packaging and assembly equipment market is segmented on the basis of process type and application areas. There are a number of packaging and assembly equipment processes adopted in the industry, such as plating, inspection and dicing, wire bonding, die-bonding, and others. The Die bonding held the major share in 2018. On the other hand, plating process is anticipated to be the fastest growing segment during the forecast period (2019-2025). On the basis of application, the market is bifurcated into consumer electronics, communication, automotive, industrial and others. In 2018, communications held the major share of the Asian semiconductor packaging and assembly equipment market. However, owing to the increase in demand of advanced electronics due to growing electrification and automation of automobiles, automotive application segment is anticipated to show a remarkable CAGR during the forecast period.
    “The governmental funds and policies such as the National Fund and local Integrated Circuits (IC) funds, created in 2014, and the Made in China 2025 policy are some of the major reasons fuelling the demand within China”
    Further, semiconductor packaging and assembly market report is bifurcated across several countries. This includes China, Japan, India, South Korea, Singapore, Taiwan and the rest of APAC. Taiwan dominated the market in 2018 and is expected to maintain its dominance while, China is expected to showcase a notable CAGR during the forecast period. The governmental funds and policies such as the National Fund and local Integrated Circuits (IC) funds, created in 2014, and the Made in China 2025 policy are some of the major reasons fuelling the demand within China.
    Competitive Landscape-Top 10 Market Players
    Some of the key players in the market include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics, Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group. These players are adopting several market strategies, such as merger & acquisition, business expansion and collaboration, among others to strengthen their foothold in the industry.
    Reasons to buy this report:
    • Historical and forecast market size validated through primary and secondary sources
    • In depth analysis of prominent industry peers with primary focus on key business financials, product portfolio, expansion strategies, SWOT analysis and recent developments
    • Examination on drivers, restraints, key trends and opportunities prevailing in the industry.
    • Examination of industry attractiveness with the help of Porter’s Five Forces analysis
    • Comprehensive coverage of the market across different market segments
    • Deep dive country level analysis of the industry
    Customization Options:
    The Asia-Pacific semiconductor packaging and assembly market report can be customized, focusing a specific country or any other market segment. Besides this, understands that you may have your own business need, please connect with our analyst, who will ensure you get a report that suits your needs