Special copper clad laminates are mainly high-speed/high-frequency boards and package substrates, including: BT/epoxy glass fiber board, modified FR-4 (low CTE and low Dk/Df), PPO modified epoxy board, BT-like board , PTFE board, hydrocarbon board, PI / fiberglass board. Special CCL applications: IC carrier board, high speed digital, RF wireless, space, test

The global Special Copper Clad Laminate market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Special Copper Clad Laminate volume and value at global level, regional level and company level. From a global perspective, this report represents overall Special Copper Clad Laminate market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of Special Copper Clad Laminate in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Special Copper Clad Laminate manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
Rogers
Mitsubishi Gas
Hitachi Chemical
Isola
Park Electrochemical
Panasonic Electrician
Doosan Electronics
TACONIC
NAN YA PLASTICS
SYTECH
Taiwan Union Technology Corporation (TUC)

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
BT/epoxy fiberglass cloth board
Modified FR-4 (low CTE and low Dk/Df)
PPO modified epoxy board
BT-like board
PTFE board
Hydrocarbon board
PI/glass fiber cloth board

Segment by Application
IC Carrier Board
High Speed Digital
RF Wireless
Space
Test