Summary
Epi/chip. Epitaxy refers to the process of evolving a wafer (sapphire or SiC, for instance) by depositing epitaxial layers on the wafer using MOCVD. Creating the epitaxial layers is the most critical and capital-intensive step in LED manufacturing. After additional wafer processing to create the metal connection, the wafer is cut up (""diced"") into chips. Although it can be used for different applications, the quality requirements (mainly efficacy) of the epi/chip differ by application.Module (sometimes called light engine). Creation of a module (light engine) is the next step in the LED lighting value chain. The module (light engine) mainly consists of one or more LED packages, secondary optics, a heat sink and an electrical driver. The LEDs are mounted on a PCB (printed circuit board), and the modules (light engines) are integrated with optics and thermal/power management components to optimize the module (light engine) to each application.
This report describes the development of the industry by upstream & downstream, industry overall and development, key companies, as well as type segment & market application and so on, and makes a scientific prediction for the development industry prospects on the basis of analysis, finally, analyzes opportunities for investment in the industry at the end of the report.
Industry Chain
Raw Materials
Cost
Technology
Consumer Preference
Industry Overall:
History
Development & Trend
Market Competition
Trade Overview
Policy
Region (North America, Europe, Asia-Pacific, South America, Middle East, Africa):
Regional Market
Production Development
Sales
Regional Trade
Regional Forecast
Company (Epistar, San’an Opto, Cree, OSRAM, Toyoda Gosei, Toyoda Gosei, Seoul Semiconductor, Philips Lumileds, ETI, LG Innotek, NiChia, HC SemiTek, Lextar, Lattice Power, OPTO-TECH, Tyntek, Genesis Photonics, Formosa Epitaxy, Changelight, Aucksun, TongFang etc.):
Company Profile
Product & Service
Business Operation Data
Market Share
Investment Analysis:
Market Features
Investment Opportunity
Investment Calculation