Snapshot
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
The global IC-Substrate market will reach Volume Million USD in 2017 and CAGR xx% 2011-2017. The report begins from overview of Industry Chain structure, and describes industry environment, then analyses market size and forecast of IC-Substrate by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price analysis and value chain features are covered in this report.
Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):
FC-CSP
FC-BGA
CSP
BGA
Company Coverage (Sales Revenue, Price, Gross Margin, Main Products etc.):
Ibiden(JP)
Shinko Electric Industries(JP)
Kyocera(JP)
Eastern(JP)
TTM Technologies(US)
Unimicron(TW)
Kinsus(TW)
Nanya(TW)
ASE(TW)
Semco(KR)
LG Innotek(KR)
Simmtech(KR)
Daeduck(KR)
KCC(KR)
Zhen Ding Technology(TW)
AT&S (a Austrian company, has IC substrate factories in Chongqing, China)
Shennan Circuit(CN)
ACCESS(CN)
Shenzhen Fastprint Circuit Tech(CN)
Application Coverage (Market Size & Forecast, Different Demand Market by Region, Main Consumer Profile etc.):
PC (Tablet, Laptop)
Smart Phone
Wearable Devices
Others
Region Coverage (Regional Output, Demand & Forecast by Countries etc.):
North America
Europe
Asia-Pacific
South America
Middle East & Africa