Summary
High Density Interconnects (HDI) board is defined as a board (PCB) with a higher wiring density per Unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 μm), smaller vias (<150 μm) and capture pads (<400 μm), I/O>300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
This report describes the development of the industry by upstream & downstream, industry overall and development, key companies, as well as type segment & market application and so on, and makes a scientific prediction for the development industry prospects on the basis of analysis, finally, analyzes opportunities for investment in the industry at the end of the report.
Industry Chain
Raw Materials
Cost
Technology
Consumer Preference
Industry Overall:
History
Development & Trend
Market Competition
Trade Overview
Policy
Region (North America, Europe, Asia-Pacific, South America, Middle East, Africa):
Regional Market
Production Development
Sales
Regional Trade
Regional Forecast
Company (Unimicron, Compeq, AT&S, SEMCO, TTM, TTM, ZDT, Tripod, DAP, Unitech, Multek, LG Innotek, Young Poong (KCC), Meiko, Daeduck etc.):
Company Profile
Product & Service
Business Operation Data
Market Share
Investment Analysis:
Market Features
Investment Opportunity
Investment Calculation