Summary
During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.
This report describes the development of the industry by upstream & downstream, industry overall and development, key companies, as well as type segment & market application and so on, and makes a scientific prediction for the development industry prospects on the basis of analysis, finally, analyzes opportunities for investment in the industry at the end of the report.
Industry Chain
Raw Materials
Cost
Technology
Consumer Preference
Industry Overall:
History
Development & Trend
Market Competition
Trade Overview
Policy
Region (North America, Europe, Asia-Pacific, South America, Middle East, Africa):
Regional Market
Production Development
Sales
Regional Trade
Regional Forecast
Company (ASE, Amkor, SPIL, Stats Chippac, JCET, JCET, J-Devices, UTAC, Chipmos, Chipbond, STS, Huatian, NFM, Carsem, Walton, Unisem, OSE, AOI, Formosa, NEPES etc.):
Company Profile
Product & Service
Business Operation Data
Market Share
Investment Analysis:
Market Features
Investment Opportunity
Investment Calculation