An image sensor or imaging sensor (also: imager) is a sensor that detects and conveys information used to make an image. It does so by converting the variable attenuation of light waves (as they pass through or reflect off objects) into signals, small bursts of current that convey the information.
There are two main types of image sensors: Charged coupled device (CCD) and Complementary metal oxide semiconductor (CMOS).

The global 3D Acoustic and Image Sensor market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on 3D Acoustic and Image Sensor volume and value at global level, regional level and company level. From a global perspective, this report represents overall 3D Acoustic and Image Sensor market size by analyzing historical data and future prospect.
Regionally, this report categorizes the production, apparent consumption, export and import of 3D Acoustic and Image Sensor in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their 3D Acoustic and Image Sensor manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.

The following manufacturers are covered:
ASUSTeK Computer
Cognex Corporation
LMI Technologies
Melexis
Microchip Technology
Microsoft Corporation
Infineon Technologies AG
Intel Corporation
IFM Electronic
Occipital
OmniVision Technologies
PMD Technologies AG
Qualcomm Technologies
STMicroelectronics
Texas Instruments
SoftKinetic
TriDiCam

Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India

Segment by Type
3D Acoustic Sensor
3D Image Sensor

Segment by Application
Consumer Electronics
Robotics and Drone
Machine Vision and Industrial Automation
Entertainment
Security and Surveillance
Automobile
Others