Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

Scope of the Report:
This report focuses on the Plating for Microelectronics in Asia-Pacific market, especially in China, Japan, Korea, Taiwan, Southeast Asia, India and Australia. This report categorizes the market based on manufacturers, countries/Regions, type and application.

Market Segment by Manufacturers, this report covers
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International

Market Segment by Countries, covering
China
Japan
Korea
Taiwan
Southeast Asia
India
Australia

Market Segment by Type, covers
Electroplating
Electroless
Immersion

Market Segment by Applications, can be divided into
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others

There are 19 Chapters to deeply display the Asia-Pacific Plating for Microelectronics market.

Chapter 1, to describe Plating for Microelectronics Introduction, product type and application, market overview, market analysis by countries, market opportunities, market risk, market driving force;

Chapter 2, to analyze the manufacturers of Plating for Microelectronics, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017;

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;

Chapter 4, to show the Asia-Pacific market by countries, covering China, Japan, Korea, Southeast Asia, Taiwan, India and Australia, with sales, price, revenue and market share of Plating for Microelectronics, for each country, from 2013 to 2018;

Chapter 5 and 6, to show the market by type and application, with sales, price, revenue, market share and growth rate by type, application, from 2013 to 2018;

Chapter 7, 8, 9, 10, 11, 12 and 13 to analyze the key countries by manufacturers, Type and Application, covering 7 Regin, with sales, revenue and market share by manufacturers, types and applications;

Chapter 14, Plating for Microelectronics market forecast, by countries, type and application, with sales, price, revenue and growth rate forecast, from 2018 to 2023;

Chapter 15, to analyze the manufacturing cost, key raw materials and manufacturing process, etc.

Chapter 16, to analyze the industrial chain, sourcing strategy and downstream end users (buyers);

Chapter 17, to describe sales channel, distributors, traders, dealers, etc.

Chapter 18 and 19, to describe the research findings and conclusion, appendix, methodology and data source.