Asia-Pacific Hot-Melt Based Packaging Adhesives Market Analysis 2012-2017 and Forecast 2018-2023

SKU ID :99ST-11387720 | Published Date: 06-Apr-2018 | No. of pages: 110
Snapshot
The hot melt adhesives are defined as adhesives that melt and flow on application of heat and solidify on cooling to give a strong adhesion. They are applied in a molten state at temperatures that range from 120°C to 180°C depending on applications and materials to be bonded.
The Asia-Pacific Hot-Melt Based Packaging Adhesives market will reach xxx Million USD in 2018 and CAGR xx% 2018-2023. The report begins from overview of Industry Chain structure, and describes industry environment, then analyses market size and forecast of Hot-Melt Based Packaging Adhesives by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price analysis and value chain features are covered in this report.
Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):
EVA HMA
SBC HMA
PA HMA
APAO HMA
POE HMA





Company Coverage (Sales Revenue, Price, Gross Margin, Main Products etc.):
H. B. Fuller
Henkel
Bostik (Arkema)
3M
Sika
Beardow Adams
Jowat
Avery Dennison
Adtek Malaysia
Cherng Tay Technology
Star Bond (Thailand)
Makro Rekat Sekawa
Yenom
PT.MORESCO MACRO ADHESIVE
Tex Year Industries
Nan Pao
Paramelt
Application Coverage (Market Size & Forecast, Different Demand Market by Region, Main Consumer Profile etc.):
Case & Carton
Plastic Packaging
Labeling
Line Packaging
Others
Region Coverage (Regional Production, Demand & Forecast by Regions etc.):
China
Japan & Korea
India
Southeast Asia
Oceania
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