Snapshot
DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic.
The Asia-Pacific DBC Ceramic Substrate market will reach xxx Million USD in 2018 and CAGR xx% 2018-2023. The report begins from overview of Industry Chain structure, and describes industry environment, then analyses market size and forecast of DBC Ceramic Substrate by product, region and application, in addition, this report introduces market competition situation among the vendors and company profile, besides, market price analysis and value chain features are covered in this report.
Product Type Coverage (Market Size & Forecast, Major Company of Product Type etc.):
AlN DBC Ceramic Substrate
Al2O3 DBC Ceramic Substrate
Company Coverage (Sales Revenue, Price, Gross Margin, Main Products etc.):
Rogers/Curamik (Germany)
KCC (Korea)
Ferrotec(Shanghai Shenhe Thermo-Magnetics Electronics) (China)
Heraeus Electronics (Germany)
Tong Hsing (Taiwan)
Remtec (US)
Stellar Industries Corp (US)
Nanjing Zhongjiang New Material Science & Technology (China)
Zibo Linzi Yinhe High-Tech Development (China)
NGK Electronics Devices (Japan)
IXYS (Germany Division)
Mitsubishi Materials (Japan)
Application Coverage (Market Size & Forecast, Different Demand Market by Region, Main Consumer Profile etc.):
Power Electronics
Automotive
Home Appliances and CPV
Aerospace and Others
Region Coverage (Regional Production, Demand & Forecast by Regions etc.):
China
Japan & Korea
India
Southeast Asia
Oceania