Table of Contents: 1 Executive Summary 2 Market Introduction 2.1 Definition 2.2 Scope of the Study 2.3 List of Assumptions 2.4 Market Structure 3 Research Methodology 3.1 Research Process 3.2 Secondary Research 3.3 Primary Research 3.4 Forecast Model 4 Market Dynamics 4.1 Introduction 4.2 Drivers 4.2.1 Rising Demand for Miniaturization of Portable Electronics Devices 4.2.2 Increasing Use in the Automotive Industry 4.2.3 Driver Impact Analysis 4.3 Restraints 4.3.1 Concerns Regarding Heat Dissipation 4.3.2 Restraint Impact Analysis 4.4 Opportunities 4.4.1 Proliferation of IoT and Wireless Devices 4.5 Supply Chain Analysis 4.6 Porter’s Five Forces Model 4.6.1 Threat of New Entrants 4.6.2 Bargaining Power of Suppliers 4.6.3 Threat of Substitutes 4.6.4 Bargaining Power of Buyers 4.6.5 Intensity of Rivalry 5 Market Alerts 5.1 Market Trends 5.1.1 Current Development in 3D Substrate Technology 5.2 Use Cases 5.2.1 3D Packaging Technology for Microelectronics 5.2.2 3D heterogenous integration technologies to support Artificial Intelligence (AI) 6 Global 3D Semiconductor Packaging Market, By Type 6.1 Overview 6.1.1 3D SIP (System in Package) 6.1.2 3D WLP 6.1.3 3D SIC 6.1.4 3D IC 7 Global 3D Semiconductor Packaging Market, By Packaging Method 7.1 Overview 7.1.1 Package on Package 7.1.2 Through Silicon Via (TSV) 7.1.3 Through Glass Via (TGV) 7.1.4 Others 8 Global 3D Semiconductor Packaging Market, By End-User 8.1 Overview 8.1.1 Consumer Electronics 8.1.2 Telecommunication` 8.1.3 Industrial 8.1.4 Automotive 8.1.5 Military & Aerospace 9 3D Semiconductor Packaging Market, By Region 9.1 Introduction 9.2 North America 9.2.1 US 9.2.2 Canada 9.2.3 Mexico 9.3 Europe 9.3.1 UK 9.3.2 Germany 9.3.3 France 9.3.4 Rest of Europe 9.4 Asia-Pacific 9.4.1 China 9.4.2 Japan 9.4.3 India 9.4.4 South Korea 9.4.5 Rest of Asia-Pacific 9.5 Rest of the World 9.5.1 Middle East & Africa 9.5.2 Latin America 10 Competitive Landscape 10.1 Overview 11 Company Profiles 11.1 Jiangsu Changjiang Electronics Technology Co., Ltd 11.1.1 Company Overviews 11.1.2 Financial Overview 11.1.3 Products/Solution/Services Offered 11.1.4 Key Developments 11.2 Intel Corporation 11.2.1 Company Overviews 11.2.2 Financial Overview 11.2.3 Products/Solution/Services Offered 11.2.4 Key Developments 11.2.5 SWOT Analysis 11.2.6 Key Strategy 11.3 Siliconware Precision Industries Co., Ltd 11.3.1 Company Overviews 11.3.2 Financial Overview 11.3.3 Products/Solution/Services Offered 11.3.4 Key Developments 11.4 STMicroelectronics NV 11.4.1 Company Overviews 11.4.2 Financial Overview 11.4.3 Products/Solution/Services Offered 11.4.4 Key Developments 11.4.5 SWOT Analysis 11.4.6 Key Strategy 11.5 Xilinx Inc. 11.5.1 Company Overviews 11.5.2 Financial Overview 11.5.3 Products/Solution/Services Offered 11.5.4 Key Developments 11.5.5 SWOT Analysis 11.5.6 Key Strategy 11.6 Samsung Electronics Corporation Ltd 11.6.1 Company Overview 11.6.2 Financial Overview 11.6.3 Products/Services Offered 11.6.4 Key Developments 11.6.5 SWOT Analysis 11.6.6 Key Strategy 11.7 Taiwan Semiconductor Manufacturing Co. Ltd. 11.7.1 Company Overview 11.7.2 Financial Overview 11.7.3 Products/Services Offered 11.7.4 Key Developments 11.7.5 SWOT Analysis 11.7.6 Key Strategy 11.8 Advanced Semiconductor Engineering Inc. 11.8.1 Company Overview 11.8.2 Financial Overview 11.8.3 Products/Services Offered 11.8.4 Key Developments 11.8.5 SWOT Analysis 11.8.6 Key Strategy 11.9 ams AG 11.9.1 Company Overview 11.9.2 Financial Overview 11.9.3 Products/Services Offered 11.9.4 Key Developments 11.9.5 SWOT Analysis 11.9.6 Key Strategy 11.1 Amkor Technology Inc. 11.10.1 Company Overview 11.10.2 Financial Overview 11.10.3 Products/Services Offered 11.10.4 Key Developments 11.10.5 SWOT Analysis 11.10.6 Key Strategy

List of Tables: TABLE 1 MARKET SYNOPSIS TABLE 2 LIST OF ASSUMPTIONS TABLE 3 RECENT DEVELOPMENTS: TABLE 4 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 5 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 6 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 7 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY REGION, 2017–2023 (USD MILLION) TABLE 8 NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2017–2023 (USD MILLION) TABLE 9 NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 10 NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 11 NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 12 US: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 13 US: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 14 US: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 15 CANADA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 16 CANADA: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 17 CANADA: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 18 MEXICO: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 19 MEXICO: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 20 MEXICO: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 21 EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2017–2023 (USD MILLION) TABLE 22 EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 23 EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 24 EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 25 UK: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 26 UK: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 27 UK: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 28 GERMANY: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 29 GERMANY: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 30 GERMANY: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 31 FRANCE: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 32 FRANCE: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 33 FRANCE: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 34 REST OF EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 35 REST OF EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 36 REST OF EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 37 ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2017–2023 (USD MILLION) TABLE 38 ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 39 ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 40 ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 41 CHINA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 42 CHINA: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 43 CHINA: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 44 JAPAN: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 45 JAPAN: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 46 JAPAN: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 47 INDIA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 48 INDIA: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 49 INDIA: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 50 SOUTH KOREA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 51 SOUTH KOREA: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 52 SOUTH KOREA: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 53 REST OF ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 54 REST OF ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 55 REST OF ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 56 REST OF THE WORLD: 3D SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2017–2023 (USD MILLION) TABLE 57 REST OF THE WORLD: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 58 REST OF THE WORLD: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 59 REST OF THE WORLD: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 60 MIDDLE EAST & AFRICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 61 MIDDLE EAST & AFRICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 62 MIDDLE EAST & AFRICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION) TABLE 63 LATIN AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017–2023 (USD MILLION) TABLE 64 LATIN AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017–2023 (USD MILLION) TABLE 65 LATIN AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017–2023 (USD MILLION)List of Figures: FIGURE 1 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET: MARKET STRUCTURE FIGURE 2 TOP DOWN & BOTTOM UP APPROACH FIGURE 3 DRIVERS, RESTRAINT, AND OPPORTUNITY ANALYSIS OF GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET FIGURE 4 INDUSTRY SUPPLY CHAIN: SEMICONDUCTOR AND ELECTRONICS FIGURE 5 SUPPLY CHAIN: 3D SEMICONDUCTOR PACKAGING FIGURE 6 PORTER'S FIVE FORCES ANALYSIS OF 3D SEMICONDUCTOR PACKAGING MARKET FIGURE 7 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017 VS 2023 (USD MILLION) FIGURE 8 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017 VS 2023 (USD MILLION) FIGURE 9 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017 VS 2023 (USD MILLION) FIGURE 10 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY REGION, 2017 VS 2023 (USD MILLION) FIGURE 11 NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, BY COUNTRY, 2017 VS 2023 (USD MILLION) FIGURE 12 NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017 VS 2023 (USD MILLION) FIGURE 13 NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017 VS 2023 (USD MILLION) FIGURE 14 NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017 VS 2023 (USD MILLION) FIGURE 15 EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, BY COUNTRY, 2017 VS 2023 (USD MILLION) FIGURE 16 EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017 VS 2023 (USD MILLION) FIGURE 17 EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017 VS 2023 (USD MILLION) FIGURE 18 EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017 VS 2023 (USD MILLION) FIGURE 19 ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, BY COUNTRY, 2017 VS 2023 (USD MILLION) FIGURE 20 ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017 VS 2023 (USD MILLION) FIGURE 21 ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017 VS 2023 (USD MILLION) FIGURE 22 ASIA-PACIFIC: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017 VS 2023 (USD MILLION) FIGURE 23 REST OF THE WORLD: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, BY COUNTRY, 2017 VS 2023 (USD MILLION) FIGURE 24 REST OF THE WORLD: 3D SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2017 VS 2023 (USD MILLION) FIGURE 25 REST OF THE WORLD: 3D SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING METHOD, 2017 VS 2023 (USD MILLION) FIGURE 26 REST OF THE WORLD: 3D SEMICONDUCTOR PACKAGING MARKET, BY END-USER, 2017 VS 2023 (USD MILLION) FIGURE 27 COMPETITIVE BENCHMARKING OF MAJOR COMPETITORS

Advanced Semiconductor Engineering Inc., Siliconware Precision Induatries Co., Ltd., Xilinx Inc., Taiwan Semiconductor Manufacturing Co. Ltd., and ams AG, Amkor Tecnhology Inc., Intel Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., STMicroelectronics NV, Samsung Electronics Corporation Ltd.