PART 01: EXECUTIVE SUMMARY PART 02: SCOPE OF THE REPORT 2.1 Preface 2.2 Preface 2.3 Currency conversion rates for US$ PART 03: MARKET LANDSCAPE Market ecosystem Market characteristics Market segmentation analysis PART 04: MARKET SIZING Market definition Market sizing 2018 Market size and forecast 2018-2023 PART 05: FIVE FORCES ANALYSIS Bargaining power of buyers Bargaining power of suppliers Threat of new entrants Threat of substitutes Threat of rivalry Market condition PART 06: MARKET SEGMENTATION BY PRODUCT Market segmentation by product Comparison by product ICs - Market size and forecast 2018-2023 Optoelectronics - Market size and forecast 2018-2023 Discrete semiconductors - Market size and forecast 2018-2023 Sensors - Market size and forecast 2018-2023 Market opportunity by product PART 07: CUSTOMER LANDSCAPE PART 08: GEOGRAPHIC LANDSCAPE Geographic segmentation Geographic comparison APAC - Market size and forecast 2018-2023 Americas - Market size and forecast 2018-2023 EMEA - Market size and forecast 2018-2023 Key leading countries Market opportunity PART 09: DECISION FRAMEWORK PART 10: DRIVERS AND CHALLENGES Market drivers Market challenges PART 11: MARKET TRENDS Increasing adoption of FinFET technology Growing number of partnerships Increasing demand for high-end graphics DRAM Emerging semiconductor packaging technologies In-sourcing services and equipment automation PART 12: VENDOR LANDSCAPE Overview Landscape disruption PART 13: VENDOR ANALYSIS Vendors covered Vendor classification Market positioning of vendors Intel Corporation Micron Technology, Inc. Qualcomm Technologies, Inc. SAMSUNG ELECTRONICS CO., LTD. SK HYNIX INC. PART 14: APPENDIX Research methodology List of abbreviations PART 15: EXPLORE TECHNAVIO Exhibit 01: Global electronics market Exhibit 02: Segments of global electronics market Exhibit 03: Market characteristics Exhibit 04: Market segments Exhibit 05: Market definition - Inclusions and exclusions checklist Exhibit 06: Market size 2018 Exhibit 07: Global market: Size and forecast 2018-2023 ($ billions) Exhibit 08: Global market: Year-over-year growth 2019-2023 (%) Exhibit 09: Five forces analysis 2018 Exhibit 10: Five forces analysis 2023 Exhibit 11: Bargaining power of buyers Exhibit 12: Bargaining power of suppliers Exhibit 13: Threat of new entrants Exhibit 14: Threat of substitutes Exhibit 15: Threat of rivalry Exhibit 16: Market condition - Five forces 2018 Exhibit 17: Product - Market share 2018-2023 (%) Exhibit 18: Comparison by product Exhibit 19: ICs - Market size and forecast 2018-2023 ($ billions) Exhibit 20: ICs - Year-over-year growth 2019-2023 (%) Exhibit 21: Optoelectronics - Market size and forecast 2018-2023 ($ billions) Exhibit 22: Optoelectronics - Year-over-year growth 2019-2023 (%) Exhibit 23: Discrete semiconductors - Market size and forecast 2018-2023 ($ billions) Exhibit 24: Discrete semiconductors - Year-over-year growth 2019-2023 (%) Exhibit 25: Sensors - Market size and forecast 2018-2023 ($ billions) Exhibit 26: Sensors - Year-over-year growth 2019-2023 (%) Exhibit 27: Market opportunity by product Exhibit 28: Customer landscape Exhibit 29: Market share by geography 2018-2023 (%) Exhibit 30: Geographic comparison Exhibit 31: APAC - Market size and forecast 2018-2023 ($ billions) Exhibit 32: APAC - Year-over-year growth 2019-2023 (%) Exhibit 33: Americas - Market size and forecast 2018-2023 ($ billions) Exhibit 34: Americas - Year-over-year growth 2019-2023 (%) Exhibit 35: EMEA - Market size and forecast 2018-2023 ($ billions) Exhibit 36: EMEA - Year-over-year growth 2019-2023 (%) Exhibit 37: Key leading countries Exhibit 38: Market opportunity Exhibit 39: Impact of drivers and challenges Exhibit 40: Vendor landscape Exhibit 41: Landscape disruption Exhibit 42: Vendors covered Exhibit 43: Vendor classification Exhibit 44: Market positioning of vendors Exhibit 45: Intel Corporation - Vendor overview Exhibit 46: Intel Corporation - Business segments Exhibit 47: Intel Corporation - Organizational developments Exhibit 48: Intel Corporation - Geographic focus Exhibit 49: Intel Corporation - Segment focus Exhibit 50: Intel Corporation - Key offerings Exhibit 51: Micron Technology, Inc. - Vendor overview Exhibit 52: Micron Technology, Inc. - Business segments Exhibit 53: Micron Technology, Inc. - Organizational developments Exhibit 54: Micron Technology, Inc. - Geographic focus Exhibit 55: Micron Technology, Inc. - Segment focus Exhibit 56: Micron Technology, Inc. - Key offerings Exhibit 57: Qualcomm Technologies, Inc. - Vendor overview Exhibit 58: Qualcomm Technologies, Inc. - Business segments Exhibit 59: Qualcomm Technologies, Inc. - Organizational developments Exhibit 60: Qualcomm Technologies, Inc. - Geographic focus Exhibit 61: Qualcomm Technologies, Inc. - Segment focus Exhibit 62: Qualcomm Technologies, Inc. - Key offerings Exhibit 63: SAMSUNG ELECTRONICS CO., LTD. - Vendor overview Exhibit 64: SAMSUNG ELECTRONICS CO., LTD. - Business segments Exhibit 65: SAMSUNG ELECTRONICS CO., LTD. - Organizational developments Exhibit 66: SAMSUNG ELECTRONICS CO., LTD. - Geographic focus Exhibit 67: SAMSUNG ELECTRONICS CO., LTD. - Segment focus Exhibit 68: SAMSUNG ELECTRONICS CO., LTD. - Key offerings Exhibit 69: SK HYNIX INC. - Vendor overview Exhibit 70: SK HYNIX INC. - Organizational developments Exhibit 71: SK HYNIX INC. - Geographic focus Exhibit 72: SK HYNIX INC. - Key offerings Exhibit 73: Validation techniques employed for market sizing  

Intel Corporation Micron Technology, Inc. Qualcomm Technologies, Inc. SAMSUNG ELECTRONICS CO., LTD. SK HYNIX INC.