Global Outsourced Semiconductor Assembly and Test Market (OSAT) Market with Focus on IC Packaging (2018-2022)

SKU ID :DR-12208788 | Published Date: 01-Aug-2018 | No. of pages: 75
1. Executive Summary 2. Introduction 2.1 Integrated Circuit (IC): An Overview 2.1.1 Characteristics of Integrated Circuit (IC) 2.1.2 Integrated Circuit (IC) Manufacturing Process 2.2 Segmentation of Integrated Circuit (IC): An Overview 2.3 Outsourced Semiconductor Assembly and Test (OSAT): An Overview 2.4 Outsourced Semiconductor Assembly and Test (OSAT):Value Chain 3. Global Market Analysis 3.1 Global OSAT Market: An Analysis 3.1.1 Global OSAT Market by Value 3.1.2 Global OSAT Market by Region (China, Rest of World) 3.2 Global IC Packaging Market: An Analysis 3.2.1 Global IC Packaging Market by Value 3.2.2 Global IC Packaging Market by Segment (Wirebond Packaging, Flip Chip Packaging and Wafer Level Packaging) 3.2.3 Global IC Packaging Market by Volume 3.2.4 Global IC Packaging Market Volume by Segment (Wirebond Packaging, Flip Chip Packaging and Wafer Level Packaging) 3.3 Global IC Packaging Market: Segment Analysis 3.3.1 Global Wirebond (WB) Packaging Market by Value 3.3.2 Global Wirebond (WB) Packaging Market by Volume 3.3.3 Global Flip Chip (FC) Packaging Market by Value 3.3.4 Global Flip Chip (FC) Packaging Market by Volume 3.3.5 Global Wafer Level Packaging (WLP) Market by Value 3.3.6 Global Wafer Level Packaging (WLP) Market by Volume 4. China Market Analysis 4.1 China OSAT Market: An Analysis 5. Market Dynamics 5.1 Growth Drivers 5.1.1 Rising Automotive Production 5.1.2 Increasing Usage of Camera in Automotive 5.1.3 Rising Demand for Fingerprint Sensors 5.1.4 Rising Internet of Things (IoT) 5.1.5 Increasing Smartphone Users 5.1.6 Growing Personal Electronics 5.1.7 Rising Urban Population 5.2 Challenges 5.2.1 Threat from Foundry’s Forward Integration 5.2.2 Rising Raw Material Cost 5.2.3 Volatile Demand from Cryptocurrency 5.3 Market Trends 5.3.1 Growing Demand for AI-related Semiconductor 5.3.2 Wafer Level Chip Scale Packaging (WLCSP)Technology 5.3.3 Rising Demand for Domestic Consumer Robotics 5.3.4 Increasing Flexible Devices 6. Competitive Landscape 6.1 Global OSAT Market Players by Share 6.2 Global OSAT Market Players Financial Comparison 7. Company Profile 7.1 Advanced Semiconductor Engineering, Inc. (ASE) 7.1.1 Business Overview 7.1.2 Financial Overview 7.1.1 Business Strategy 7.2 Amkor Technology, Inc. 7.2.1 Business Overview 7.2.2 Financial Overview 7.2.1 Business Strategy 7.3 ChipMOS Technologies Inc. (ChipMOS) 7.3.1 Business Overview 7.3.2 Financial Overview 7.3.3 Business Strategy 7.4 Mubadala Investment Company (GlobalFoundries Inc.) 7.4.1 Business Overview 7.4.2 Financial Overview 7.4.3 Business Strategy List of Figures Figure 1: Characteristics of Integrated Circuit (IC) Figure 2: Integrated Circuit (IC) Manufacturing Process Figure 3: Segmentation of Integrated Circuit (IC) Figure 4: Technology Used in IC Packaging Figure 5: Global OSAT Market by Value; 2013-2018 (US$ Billion) Figure 6: Global OSAT Market by Region; 2017 (Percentage, %) Figure 7: Global IC Packaging Market by Value; 2014-2017 (US$ Billion) Figure 8: Global IC Packaging Market by Value; 2018-2022 (US$ Billion) Figure 9: Global IC Packaging Market by Segment; 2017 (Percentage, %) Figure 10: Global IC Packaging Market by Volume; 2014-2017 (Million Units) Figure 11: Global IC Packaging Market by Volume; 2018-2022 (Million Units) Figure 12: Global IC Packaging Market Volume by Segment; 2017 (Percentage, %) Figure 13: Global Wirebond Packaging (WB) Market by Value; 2014-2017 (US$ Billion) Figure 14: Global Wirebond Packaging (WB) Market by Value; 2018-2022 (US$ Billion) Figure 15: Global Wirebond (WB) Packaging Market by Volume; 2014-2017 (Million Units) Figure 16: Global Wirebond (WB) Packaging Market by Volume; 2018-2022 (Million Units) Figure 17: Global Flip Chip (FC) Packaging Market by Value; 2014-2017 (US$ Billion) Figure 18: Global Flip Chip (FC) Packaging Market by Value; 2018-2022 (US$ Billion) Figure 19: Global Flip Chip (FC) Packaging Market by Volume; 2014-2017 (Thousand Units) Figure 20: Global Flip Chip (FC) Packaging Market by Volume; 2018-2022 (Thousand Units) Figure 21: Global Wafer Level Packaging (WLP) Market by Value; 2014-2017 (US$ Billion) Figure 22: Global Wafer Level Packaging (WLP) Market by Value; 2018-2022 (US$ Billion) Figure 23: Global Wafer Level Packaging (WLP) Market by Volume; 2014-2017 (Thousand Units) Figure 24: Global Wafer Level Packaging (WLP) Market by Volume; 2018-2022 (Thousand Units) Figure 25: China OSAT Market by Value; 2013-2018 (US$ Billion) Figure 26: Global Automotive Production; 2013-2017 (Million) Figure 27: Global Automotive Camera Shipment; 2013-2020 (Million Units) Figure 28: Global Fingerprint Sensors Shipment; 2014-2018 (Million Units) Figure 29: Global Internet of Things (IoT) Connected Devices Installed Base; 2015-2022 (Billion) Figure 30: Global Smartphone Users; 2014-2020 (Billion) Figure 31: Global Personal Electronics Market; 2013-2020 (Billion Units) Figure 32: Global Urban Population by Region; 2015-2025 (Billion) Figure 33: Global AI-related Semiconductor Revenue; 2017-2022 (US$ Billion) Figure 34: Global WLCSP Market; 2012-2022 (US$ Billion) Figure 35: Global Domestic Consumer Robotics Market; 2015-2022 (US$ Billion) Figure 36: Global Wearable Technology by Shipments; 2013-2018 (Million) Figure 37: Global OSAT Market Players by Share Figure 38: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues; 2013-2017 (US$ Billion) Figure 39: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues by Segment; 2017 (Percentage, %) Figure 40: Advanced Semiconductor Engineering, Inc. (ASE) Operating Revenues by Region; 2017 (Percentage, %) Figure 41: Amkor Technology, Inc. Net Sales; 2013-2017 (US$ Billion) Figure 42: Amkor Technology, Inc. Net Sales by Segment; 2017 (Percentage, %) Figure 43: Amkor Technology, Inc. Net Sales by Region; 2017 (Percentage, %) Figure 44: ChipMOS Revenue; 2013-2017 (US$ Million) Figure 45: ChipMOS Revenue by Segment; 2017 (Percentage,%) Figure 46: ChipMOS Revenue by Region; 2017 (Percentage,%) Figure 47: Mubadala Investment Company Revenue; 2013-2017 (US$ Billion) Figure 48: Mubadala Investment Company Revenue by Segment; 2017 (Percentage, %) Figure 49: Mubadala Investment Company Revenue by Region; 2017 (Percentage, %) Table 1: Value Chain of OSAT Table 2: Global OSAT Market Players Financial Comparison; 2017
  • PRICE
  • $850
    $1400

Our Clients