Global Multi-mode Chipset Market 2018-2022
SKU ID :TNV-11158508 | Published Date: 06-Mar-2018 | No. of pages: 103Description
TOC
Table of Contents PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: MARKET LANDSCAPE
•Market ecosystem
•Global multi-mode chipset market
•Market characteristics
•Market segmentation analysis
PART 05: MARKET SIZING
•Market definition
•Market sizing 2017
•Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSIS
•Bargaining power of buyers
•Bargaining power of suppliers
•Threat of new entrants
•Threat of substitutes
•Threat of rivalry
•Market condition
PART 07: MARKET SEGMENTATION BY APPLICATION
•Segmentation by application
•Comparison by application
•Smartphones – Market size and forecast 2017-2022
•Tablets – Market size and forecast 2017-2022
•Others – Market size and forecast 2017-2022
•Market opportunity by application
PART 08: CUSTOMER LANDSCAPE
PART 09: REGIONAL LANDSCAPE
•Geographical segmentation
•Regional comparison
•APAC – Market size and forecast 2017-2022
•Americas – Market size and forecast 2017-2022
•EMEA – Market size and forecast 2017-2022
•Key leading countries
•Market opportunity
PART 10: DECISION FRAMEWORK
PART 11: DRIVERS AND CHALLENGES
•Market drivers
•Market challenges
PART 12: MARKET TRENDS
•Growing popularity of devices that support 5G NR with integrated gigabit LTE
•Increasing need to miniaturize multi-mode chipsets
•Rapid technological advancement in the field of cellular connectivity
PART 13: VENDOR LANDSCAPE
•Overview
•Landscape disruption
•Competitive scenario
PART 14: VENDOR ANALYSIS
•Vendors covered
•Vendor classification
•Market positioning of vendors
•Hisilicon Technologies
•Intel
•MediaTek
•QUALCOMM
•SAMSUNG
•Spreadtrum Communications
PART 15: APPENDIX
•List of abbreviations
Exhibit 01: Parent market
Exhibit 02: Global semiconductor market
Exhibit 03: Market characteristics
Exhibit 04: Market segments
Exhibit 05: Market definition - Inclusions and exclusions checklist
Exhibit 06: Market size 2017
Exhibit 07: Validation techniques employed for market sizing 2017
Exhibit 08: Global – Market size and forecast 2017-2022 ($ mn)
Exhibit 09: Global – Year-over-year growth 2018-2022 (%)
Exhibit 10: Five forces analysis 2017
Exhibit 11: Five forces analysis 2022
Exhibit 12: Bargaining power of buyers
Exhibit 13: Bargaining power of suppliers
Exhibit 14: Threat of new entrants
Exhibit 15: Threat of substitutes
Exhibit 16: Threat of rivalry
Exhibit 17: Market condition - Five forces 2017
Exhibit 18: Application – Market share 2017-2022 (%)
Exhibit 19: Comparison by application
Exhibit 20: Smartphone – Market size and forecast 2017-2022 ($ mn)
Exhibit 21: Multi-mode chipset market – Year-over-year growth 2018-2022 (%)
Exhibit 22: Tablet – Market size and forecast 2017-2022 ($ mn)
Exhibit 23: Tablet – Year-over-year growth 2018-2022 (%)
Exhibit 24: Others – Market size and forecast 2017-2022 ($ mn)
Exhibit 25: Others – Year-over-year growth 2018-2022 (%)
Exhibit 26: Market opportunity by application
Exhibit 27: Customer landscape
Exhibit 28: Global – Market share by geography 2017-2022 (%)
Exhibit 29: Regional comparison
Exhibit 30: APAC – Market size and forecast 2017-2022 ($ mn)
Exhibit 31: Mobile communications in APAC– Market share 2017-2022 (%)
Exhibit 32: APAC – Year-over-year growth 2018-2022 (%)
Exhibit 33: Americas – Market size and forecast 2017-2022 ($ mn)
Exhibit 34: G network shutdown date for major telecommunication vendors in Americas
Exhibit 35: Americas – Year-over-year growth 2018-2022 (%)
Exhibit 36: EMEA – Market size and forecast 2017-2022 ($ mn)
Exhibit 37: EMEA – Year-over-year growth 2018-2022 (%)
Exhibit 38: Key leading countries
Exhibit 39: Market opportunity
Exhibit 40: Timeline of mobile communication generations
Exhibit 41: Vendor landscape
Exhibit 42: Landscape disruption
Exhibit 43: Vendors covered
Exhibit 44: Vendor classification
Exhibit 45: Market positioning of vendors
Exhibit 46: Vendor overview
Exhibit 47: Broadcom – Business segments
Exhibit 48: Broadcom – Organizational developments
Exhibit 49: Broadcom – Geographic focus
Exhibit 50: Broadcom – Segment focus
Exhibit 51: Broadcom – Key offerings
Exhibit 52: Vendor overview
Exhibit 53: Intel – Business segments
Exhibit 54: Intel – Organizational developments
Exhibit 55: Intel – Geographic focus
Exhibit 56: Intel – Segment focus
Exhibit 57: Intel – Key offerings
Exhibit 58: Vendor overview
Exhibit 59: Marvell – Business segments
Exhibit 60: Marvell – Organizational developments
Exhibit 61: Marvell – Geographic focus
Exhibit 62: Marvell – Segment focus
Exhibit 63: Marvell – Key offerings
Exhibit 64: Vendor overview
Exhibit 65: MediaTek – Business segments
Exhibit 66: MediaTek – Organizational developments
Exhibit 67: MediaTek – Geographic focus
Exhibit 68: MediaTek – Segment focus
Exhibit 69: MediaTek – Key offerings
Exhibit 70: Vendor overview
Exhibit 71: QUALCOMM – Business segments
Exhibit 72: QUALCOMM – Organizational developments
Exhibit 73: QUALCOMM – Geographic focus
Exhibit 74: QUALCOMM – Segment focus
Exhibit 75: QUALCOMM – Key offerings
Exhibit 76: Other prominent vendors
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Tables & Figures
Companies
Hisilicon Technologies
Intel
MediaTek
QUALCOMM
SAMSUNG
Spreadtrum Communications
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