1 Executive Summary 10 2 Market Dynamics 11 2.1 Market Drivers 11 2.1.1 Increasing demand for advanced electronic products with a smaller form factor, and superior functionality has driven semiconductor industry to develop more innovative advanced packaging technologies 11 2.1.2 High demand for 3D packaging using TSVs driving 3D IC development 12 2.2 Market Challenges 12 2.2.1 Technical Limitation 12 2.2.2 IC/Package Co-design 13 2.3 3D ICs Supply Chain 13 2.4 Porter’s Five Forces Analysis 14 3 Global 3D ICs Market, By Technology 15 3.1 3D IC Technology Type Market 15 3.1.1 Market by Sub-segment 16 3.1.1.1 3D Stacked ICs 16 3.1.1.2 Monolithic 3D ICs 17 3.2 3D IC Packaging & Integration Type 19 3.2.1 3D System in Package (3D SiP) 19 3.2.2 3D Wafer Level Package (3D WLP) 20 3.2.3 2.5D & 3D Interposer 20 3.2.4 3D Heterogeneous Integration 21 4 Global 3D IC Market, By Component 22 4.1 Introduction 22 4.2 Market by Sub-Segment 23 4.2.1 Through Silicon Vias (TSVs) 23 4.2.2 Through Glass Vias (TGVs) 24 5 Global 3D IC Market, By Products 26 5.1 Introduction 26 5.2 Market by Sub-Segment 27 5.2.1 CMOS Image Sensors 27 5.2.2 3D Memory 28 5.2.3 MEMS & Sensors 30 5.2.4 Light Emitting Diodes (LEDs) 31   6 Global 3D ICs Market, By Applications 32 6.1 Introduction 32 6.2 Market by Sub-Segment 34 6.2.1 IT/Telecommunications 34 6.2.2 Consumer Electronics 35 6.2.3 Industrial 36 6.2.4 Aerospace & Defence 37 6.2.5 Automotive 38 6.2.6 Medical 39 7 Global 3D ICs Market, By Region 41 7.1 Introduction 41 7.2 Market by Regions 43 7.2.1 North America 43 7.2.2 Europe 49 7.2.3 Asia-Pacific 55 7.2.4 Middle East & Africa 61 8 Competitive Landscape 65 8.1 Introduction 65 8.2 Competitive Scenario 65 8.3 Market Share Analysis 66 8.4 Company Profiles 67 8.4.1 Xilinx Inc. 67 8.4.1.1 Company Overview 67 8.4.1.2 Product/Services Offering 68 8.4.1.3 Strategy 68 8.4.1.4 SWOT Analysis 69 8.4.2 Tezzaron Semiconductor Corporation 70 8.4.2.1 Company Overview 70 8.4.2.2 Product/Services Offering 70 8.4.3 Business Strategy 70 8.4.3.1 SWOT Analysis 71 8.4.4 BeSang Inc. 72 8.4.4.1 Company Overview 72 8.4.4.2 Product/Services Offering 72 8.4.4.3 Business Strategy 72 8.4.4.4 SWOT Analysis 72 8.4.5 Monolithic 3D Inc. 73 8.4.5.1 Company Overview 73 8.4.5.2 Product/Services Offering 73 8.4.5.3 Business Strategy 73 8.4.5.4 SWOT Analysis 74 8.4.6 United Microelectronics Corporation 75 8.4.6.1 Company Overview 75 8.4.6.2 Product/Services Offering 75 8.4.6.3 Business Strategy 76 8.4.6.4 SWOT Analysis 76 8.4.7 3M Company 77 8.4.7.1 Overview 77 8.4.8 Intel Corporation 78 8.4.8.1 Company Overview 78 8.4.8.2 Product/Services Offering 78 8.4.9 IBM Corporation 79 8.4.9.1 Company Overview 79 9 Appendix 80 9.1 Scope of the Study 80 9.1.1 Research Objective 80 9.1.2 Assumption 80 9.1.3 Limitation 81 9.2 Market Structure 81 10 Research Methodologies 82 10.1 Research Process 82 10.2 Primary Research 82 10.3 Secondary Research 83 10.4 Market Size Estimation 83 10.5 Forecast Model 84