PART 01: Executive summary PART 02: Scope of the report PART 03: Research Methodology PART 04: Introduction • Market outline • Semiconductor industry value chain PART 05: Market landscape • Market overview • Market size and forecast • Five forces analysis PART 06: Market segmentation by equipment type • Global semiconductor capital equipment by type • Wafer-level manufacturing equipment • Die-level packaging and assembly equipment • Automated test equipment PART 07: Market segmentation by end-user • Global semiconductor capital equipment by end-user • Foundries • Memory manufacturers • IDMs PART 08: Geographical segmentation • Global semiconductor capital equipment market by geography • APAC • Americas • EMEA PART 09: Key leading countries • Key leading countries • Taiwan • South Korea • Japan • China PART 10: Decision framework PART 11: Drivers and challenges • Market drivers • Market challenges PART 12: Market trends • Rapid changes in technology driving equipment orders • Rising prominence of 3D packaging • Large-scale development of the Chinese semiconductor industry • Automation in automobiles • Development of multi-beam e-beam inspection • Proliferation of IoT technology PART 13: Vendor landscape • Competitive scenario • Key vendors • Other prominent vendors PART 14: Appendix • List of abbreviations List of Exhibits Exhibit 01: Semiconductor industry value chain Exhibit 02: Description of semiconductor industry value chain Exhibit 03: Segmentation of global semiconductor capital equipment market Exhibit 04: Global semiconductor capital equipment market 2016-2021 ($ billions) Exhibit 05: Requirements for semiconductor capital equipment Exhibit 06: Factors influencing the purchase decisions Exhibit 07: Five forces analysis Exhibit 08: Global semiconductor capital equipment market by type 2016-2021 (% share of revenue) Exhibit 09: Global semiconductor capital equipment market by type 2016-2021 ($ billions) Exhibit 10: Global semiconductor capital equipment by wafer-level manufacturing equipment market 2016-2021 ($ billions) Exhibit 11: Global semiconductor capital equipment market by die-level packaging and assembly equipment 2016-2021 ($ billions) Exhibit 12: Global semiconductor capital equipment market by automated test equipment 2016-2021 ($ billions) Exhibit 13: Global semiconductor capital equipment market by end-user 2016-2021 (% share of revenue) Exhibit 14: Global semiconductor capital equipment market by end-user 2016-2021 ($ billions) Exhibit 15: Global semiconductor capital equipment market by foundries 2016-2021 ($ billions) Exhibit 16: Global semiconductor capital equipment market by memory manufacturers 2016-2021 ($ billions) Exhibit 17: Global semiconductor capital equipment market by IDMs 2016-2021 ($ billions) Exhibit 18: Global semiconductor capital equipment market by geography 2016-2021 (% share of revenue) Exhibit 19: Global semiconductor capital equipment market by geography 2016-2021 ($ billions) Exhibit 20: Semiconductor capital equipment market in APAC 2016-2021 ($ billions) Exhibit 21: Global semiconductor capital equipment market in Americas 2016-2021 ($ billions) Exhibit 22: Semiconductor capital equipment market in EMEA 2016-2021 ($ billions) Exhibit 23: Key leading countries Exhibit 24: Share of key leading countries 2016-2021 (% share of revenue) Exhibit 25: Forecast by application of semiconductor devices 2016 and 2021 (% share of revenue) Exhibit 26: Global NAND flash market 2016-2021 (% share of revenue) Exhibit 27: Global semiconductor market trend 1990-2016 ($ billions) Exhibit 28: Timeline for semiconductor wafer size advances Exhibit 29: Principle parameters of competition Exhibit 30: R&D spending of leading vendors 2016 Exhibit 31: Vendor share in global semiconductor capital equipment market 2016 (% share of revenue) Exhibit 32: Key vendors Exhibit 33: Other prominent vendors

Applied Materials, ASML, KLA-Tencor, Lam Research, and Tokyo Electron. ASM International, ADVANTEST, Hitachi High-Technologies, Kulicke & Soffa, Nikon, Planar, Rudolph Technologies, SCREEN Semiconductor Solutions (SCREEN Holdings), Teradyne, TOKYO SEIMITSU, and Veeco Instruments.