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In this report, covers the present scenario (with the base year being 2017) and the growth prospects of global Radiation Hardened Electronics and Semiconductors market for 2018-2023.
Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. Radiation hardened devices are primarily used in high altitude applications where radiation could damage functioning of electronic components. Radiation tolerant components are employed in satellite system power supply, switching regulators, and microprocessors in military and space applications. The prevention of gamma radiation and neutron radiation caused by nuclear reactors is possible due to radiation hardened components.
Over the next five years, projects that Radiation Hardened Electronics and Semiconductors will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.
This report presents a comprehensive overview, market shares, and growth opportunities of Radiation Hardened Electronics and Semiconductors market by product type, application, key manufacturers and key regions.
To calculate the market size, considers value and volume generated from the sales of the following segments:
Segmentation by product type:
Processors & Controllers
Logic
Memory
Power Management
ASICs
FPGAs
Segmentation by application:
Aerospace & Defense
Space
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
Honeywell Aerospace
BAE Systems
Microsemi Corporation
Xilinx Incorporation
Texas Instruments
Maxwell Technologies
Intersil Corporation
Atmel Corporation
Linear Technology Corporation
ST Microelectronics
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Radiation Hardened Electronics and Semiconductors consumption (value & volume) by key regions/countries, product type and application, history data from 2013 to 2017, and forecast to 2023.
To understand the structure of Radiation Hardened Electronics and Semiconductors market by identifying its various subsegments.
Focuses on the key global Radiation Hardened Electronics and Semiconductors manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Radiation Hardened Electronics and Semiconductors with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Radiation Hardened Electronics and Semiconductors submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Radiation hardening is a technique of making electronics and semiconductors devices resistant to damage caused by radiation. Radiation hardened devices are primarily used in high altitude applications where radiation could damage functioning of electronic components. Radiation tolerant components are employed in satellite system power supply, switching regulators, and microprocessors in military and space applications. The prevention of gamma radiation and neutron radiation caused by nuclear reactors is possible due to radiation hardened components.
Over the next five years, projects that Radiation Hardened Electronics and Semiconductors will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.
This report presents a comprehensive overview, market shares, and growth opportunities of Radiation Hardened Electronics and Semiconductors market by product type, application, key manufacturers and key regions.
To calculate the market size, considers value and volume generated from the sales of the following segments:
Segmentation by product type:
Processors & Controllers
Logic
Memory
Power Management
ASICs
FPGAs
Segmentation by application:
Aerospace & Defense
Space
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
Honeywell Aerospace
BAE Systems
Microsemi Corporation
Xilinx Incorporation
Texas Instruments
Maxwell Technologies
Intersil Corporation
Atmel Corporation
Linear Technology Corporation
ST Microelectronics
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global Radiation Hardened Electronics and Semiconductors consumption (value & volume) by key regions/countries, product type and application, history data from 2013 to 2017, and forecast to 2023.
To understand the structure of Radiation Hardened Electronics and Semiconductors market by identifying its various subsegments.
Focuses on the key global Radiation Hardened Electronics and Semiconductors manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the Radiation Hardened Electronics and Semiconductors with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of Radiation Hardened Electronics and Semiconductors submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Frequently Asked Questions
This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.
- By product type
- By End User/Applications
- By Technology
- By Region
The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
