2017-2022 Global and Japan Semiconductor Manufacturing Equipment Market Analysis Report

SKU ID : QYJAP- 10616665

Publishing Date : 23-Oct-2017

No. of pages : 109

PRICE
3085
6170


  • The global Semiconductor Manufacturing Equipment market is valued at XX million USD in 2016 and is expected to reach XX million USD by the end of 2017, growing at a CAGR of XX% between 2016 and 2022.

    Japan plays an important role in global market, with market size of xx million USD in 2016 and will be xx million USD in 2017, with a CAGR of xx%.

    This report, with focus on top players in the global and Japan, studies the Semiconductor Manufacturing Equipment market's development status and future trend in the global and Japan. It splits Semiconductor Manufacturing Equipment market by type and by applications to fully and deeply research and reveal market profile and prospect.

    The major players include
    Applied Materials Inc. (US)
    ASML Holdings N.V. (Netherlands)
    Tokyo Electron Limited (Japan)
    LAM RESEARCH Corporation (US)
    KLA-Tencor (US)
    DNS (Japan)
    Advantest (Japan)
    Teradyne (US)
    Hitach (Japan)
    Nikon (Japan)

    Geographically, this report splits the Global market into the following regions:
    Asia Pacific
    Japan
    Tokyo
    Yokohama
    Osaka
    Nagoya
    Others
    China
    Korea
    India
    Others
    Europe
    France
    Germany
    United Kingdom
    Italy
    Russia
    Others
    North America
    United States
    Canada
    Latin America
    Brazil
    Mexico
    Others
    Southeast Asia
    Singapore
    Malaysia
    Vietnam
    Myanmar
    Thailand
    Indonesia
    Philippines
    Others
    Middle East & Africa
    Saudi Arabia
    Iran
    UAE
    Turkey
    Israel
    Egypt
    South Africa
    Others

    On the basis of product, the Semiconductor Manufacturing Equipment market is primarily split into
    By Front-end Equipment
    Lithography
    Wafer surface conditioning equipment
    Cleaning processes
    Others
    By Backend Equipment
    Assembly & packaging equipment
    Dicing equipment
    Bonding equipment
    Metrology equipment
    Test equipment
    By Fab-facility
    Automation
    Chemical control equipment
    Gas control equipment
    Others
    By Dimension
    2D
    2.5D
    3D

    Key Applications
    Integrated Circuits
    Optoelectronic Devices
    Discrete Devices
    Sensors