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The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived at USD 3.6 billion in the first quarter of 2018, up year-on-year but down sequentially. The sequential decline was attributed mainly to the weak seasonal effect and quarter-end inventory clearance at upstream. The industry is forecast to enjoy both year-on-year and sequential growth in the second quarter of 2018. While smartphone demand is slowing down, HPC (High Performance Computing) and AI applications are to become major growth drivers to push up high-end wafer-level packaging demand and thus the industry is anticipated to maintain slight growth this year.
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