Global Wire Bonder Equipment Sales Market Report 2021

SKU ID : QYR- 17814000

Publishing Date : 29-Mar-2021

No. of pages : 126

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  • Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.
    According to the report, one of the major drivers for this market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is characterized by relationship-based sales. The selling price of such equipment is usually in the range of $100,000-$1,000,000. Therefore, manufacturers look to develop long-standing relations with customers buying their product offerings. The outlook of building such relations is to ensure repeat purchases by offering discounts and incentives for future orders. This is mostly practiced on those customers who account for around 5-10% of the equipment manufacturers sales.

    Market Analysis and Insights: Global Wire Bonder Equipment Market
    The global Wire Bonder Equipment market was valued at US$ XX in 2020 and will reach US$ XX million by the end of 2027, growing at a CAGR of XX% during 2022-2027.

    Global Wire Bonder Equipment Scope and Market Size
    The global Wire Bonder Equipment market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Wire Bonder Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027.

    Segment by Type
    Ball Bonders
    Stud-Bump Bonders
    Others

    Segment by Application
    Industrial
    Manufacture
    Others

    The Wire Bonder Equipment market is analysed and market size information is provided by regions (countries). Segment by Application, the Wire Bonder Equipment market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions.

    By Company
    ASM Pacific Technology
    Kulicke& Soffa
    Palomar Technologies
    Besi
    DIAS Automation
    F&K Delvotec Bondtechnik
    Hesse
    Hybond
    SHINKAWA Electric
    Toray Engineering
    West Bond

    Frequently Asked Questions



    This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.

    • By product type
    • By End User/Applications
    • By Technology
    • By Region

    The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.
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